The manufacturing of integrated circuits is not a perfect fault-free process. The constant downscaling of integrated circuits requiring higher accuracy each generation also allows the designer to fit more transistors in the same area. From a manufacturing point of view, this downscaling introduces additional possible sources of error, which forces a constant struggle to keep the yield or ratio of successfully manufactured chips high enough to be profitable. The manufacturing success ratio, or yield, is a major component of what determines the time and material cost it takes to manufacture an integrated circuit.<br><br> To increase yield a common approach is to add redundant or spare parts to the system requiring only enough of them to work....
In this chapter, we are going to discuss yield loss mechanisms, yield analysis and common physical d...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
This research develops yield and reliability models for fault-tolerant semiconductor integrated circ...
Abstract — An increasing number of hardware failures can be attributed to device reliability problem...
Repairable embedded memories help improve the overall yield of an IC. We have developed a yield anal...
The continued increase in microprocessor clock frequency that has come from advancements in fabricat...
2012-05-01Reduced scaling of feature sizes and process variations in CMOS nano-technologies introduc...
Embedded memories currently occupy more than 50% of the chip area for typical SOC integrated circuit...
It becomes increasingly difficult to achieve a high manufacturing yield for multi-core chips due to ...
This paper describes an ASIC yield model based on the CMOS bridge fault model. The model predicts de...
Deep sub-micron VLSI technologies have led to a large increase in the number of de-vices per die as ...
In this document, we have proposed a robust conceptual strategy, in order to improve the robustness ...
University of Minnesota Ph.D. dissertation. December 2009. Major: Electrical Engineering. Advisor: D...
Abstract—Manufacturing processes in the nanoscale era are less reliable leading to lower yields. As ...
An integrated circuits become increasingly complex, geometries smaller and smaller, it has become mo...
In this chapter, we are going to discuss yield loss mechanisms, yield analysis and common physical d...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
This research develops yield and reliability models for fault-tolerant semiconductor integrated circ...
Abstract — An increasing number of hardware failures can be attributed to device reliability problem...
Repairable embedded memories help improve the overall yield of an IC. We have developed a yield anal...
The continued increase in microprocessor clock frequency that has come from advancements in fabricat...
2012-05-01Reduced scaling of feature sizes and process variations in CMOS nano-technologies introduc...
Embedded memories currently occupy more than 50% of the chip area for typical SOC integrated circuit...
It becomes increasingly difficult to achieve a high manufacturing yield for multi-core chips due to ...
This paper describes an ASIC yield model based on the CMOS bridge fault model. The model predicts de...
Deep sub-micron VLSI technologies have led to a large increase in the number of de-vices per die as ...
In this document, we have proposed a robust conceptual strategy, in order to improve the robustness ...
University of Minnesota Ph.D. dissertation. December 2009. Major: Electrical Engineering. Advisor: D...
Abstract—Manufacturing processes in the nanoscale era are less reliable leading to lower yields. As ...
An integrated circuits become increasingly complex, geometries smaller and smaller, it has become mo...
In this chapter, we are going to discuss yield loss mechanisms, yield analysis and common physical d...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
This research develops yield and reliability models for fault-tolerant semiconductor integrated circ...