The register file is one of the hottest devices in processor-based systems. Leakage reduction techniques and DTM mechanisms require a thermal characterization of the hardware. This paper presents a thermal model to analyze the temperature evolution in the shared register files found on VLIW systems. The use of this model allows the analysis of several factors that have an strong impact on the heat transfer. The results obtained can be used in the design of temperature-aware compilers and place&route tools
Power consumption and heat dissipation become key elements in the field of high-end integrated circu...
Abstract—Each semiconductor technology generation brings us closer to the imminent processor archite...
Chip Multiprocessors (CMPs) have been prevailing in the modern microprocessor market. As the signifi...
The register file is one of the hottest devices in processor-based systems. Leakage reduction techni...
This paper presents a thermal model to analyze the temperature evolution in the shared register file...
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-b...
Recent developments of high-end processors recognize temperature monitoring and tuning as one of the...
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the t...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
The continuously scaling down of CMOS technology inevitably increases the power density for high per...
Abstract—As transistors continue to evolve along Moore’s Law and silicon devices take advantage of t...
The growing packing density and power consumption of VLSI circuits have made thermal effects one of ...
This paper describes a thermal-modeling approach that is easy to use and computationally efficient f...
skadron,siva,karthick,dtarjan¦ With power density and hence cooling costs rising exponentially, proc...
Due to increasing integration density and operating frequency of today's high performance processors...
Power consumption and heat dissipation become key elements in the field of high-end integrated circu...
Abstract—Each semiconductor technology generation brings us closer to the imminent processor archite...
Chip Multiprocessors (CMPs) have been prevailing in the modern microprocessor market. As the signifi...
The register file is one of the hottest devices in processor-based systems. Leakage reduction techni...
This paper presents a thermal model to analyze the temperature evolution in the shared register file...
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-b...
Recent developments of high-end processors recognize temperature monitoring and tuning as one of the...
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the t...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
The continuously scaling down of CMOS technology inevitably increases the power density for high per...
Abstract—As transistors continue to evolve along Moore’s Law and silicon devices take advantage of t...
The growing packing density and power consumption of VLSI circuits have made thermal effects one of ...
This paper describes a thermal-modeling approach that is easy to use and computationally efficient f...
skadron,siva,karthick,dtarjan¦ With power density and hence cooling costs rising exponentially, proc...
Due to increasing integration density and operating frequency of today's high performance processors...
Power consumption and heat dissipation become key elements in the field of high-end integrated circu...
Abstract—Each semiconductor technology generation brings us closer to the imminent processor archite...
Chip Multiprocessors (CMPs) have been prevailing in the modern microprocessor market. As the signifi...