Abstract only availableThe current study is being conducted to better understand how interior capillary geometry/design and interior surface treatments may affect the thermal performance of sintered and non-sintered, grooved heat pipes. The thermal performance was quantified by measuring the temperature difference between the evaporator and condenser sections of each heat pipe while varying power inputs. Power inputs were controlled by varying the applied voltage of a DC power supply that was connected to each heat pipe via a resistive heat band. Temperature differences were measured with four strategically placed thermocouples that were connected to a data acquisition system. Experiments thus far have shown that non-sintered, grooved heat ...
In this work it is conducted an experimental study to evaluate the thermal performance of a new desi...
High performance heat pipes are widely used for the thermal control of electronic devices. Concernin...
In electrical and electronic industry due to miniaturization of electronic components heat density i...
Abstract only availableThe current study is being conducted to better understand how interior capill...
Heat pipes are widely used in thermal management of high heat flux devices due to their ability of r...
AbstractHeat pipes come handy now-a-days as they operate with highest heat conductance compared to a...
International audienceThe effect of wick structure on the performance of capillary‐driven heat pipes...
International audienceIn many industrial applications, thermal issues affect electronic components. ...
Four aluminum flat grooved heat pipes with groove widths of 0.2, 0.4, 0.8 and 1.6 mm are fabricated ...
The thermal characterization of aluminum flat grooved heat pipes is performed experimentally for dif...
The thermal characterization of aluminum flat grooved heat pipes is performed experimentally for dif...
Heat pipes are heat transfer passive devices known as heat superconductors, due to the use of the l...
Heat transport in capillary wick structures is an important parameter in loop heat pipe (LHP) design...
Pulsating Heat Pipes are ideal for compact cooling applications such as electronic cooling. In this ...
Due to the character of the original source materials and the nature of batch digitization, quality ...
In this work it is conducted an experimental study to evaluate the thermal performance of a new desi...
High performance heat pipes are widely used for the thermal control of electronic devices. Concernin...
In electrical and electronic industry due to miniaturization of electronic components heat density i...
Abstract only availableThe current study is being conducted to better understand how interior capill...
Heat pipes are widely used in thermal management of high heat flux devices due to their ability of r...
AbstractHeat pipes come handy now-a-days as they operate with highest heat conductance compared to a...
International audienceThe effect of wick structure on the performance of capillary‐driven heat pipes...
International audienceIn many industrial applications, thermal issues affect electronic components. ...
Four aluminum flat grooved heat pipes with groove widths of 0.2, 0.4, 0.8 and 1.6 mm are fabricated ...
The thermal characterization of aluminum flat grooved heat pipes is performed experimentally for dif...
The thermal characterization of aluminum flat grooved heat pipes is performed experimentally for dif...
Heat pipes are heat transfer passive devices known as heat superconductors, due to the use of the l...
Heat transport in capillary wick structures is an important parameter in loop heat pipe (LHP) design...
Pulsating Heat Pipes are ideal for compact cooling applications such as electronic cooling. In this ...
Due to the character of the original source materials and the nature of batch digitization, quality ...
In this work it is conducted an experimental study to evaluate the thermal performance of a new desi...
High performance heat pipes are widely used for the thermal control of electronic devices. Concernin...
In electrical and electronic industry due to miniaturization of electronic components heat density i...