ModIV is Nortel Networks' semiconductor fabrication facility. It specializes in producing complex designs at low cost in a short period of time. This feature allows ModIV to serve as both a production and research facility. The semiconductor manufacturing process is a series of precise layering steps carried out on silicon wafers. Each layering step occurs in one of three fabrication areas: device formation, photolithography and interconnect. One of the biggest difficulties associated with troubleshooting problems in the semiconductor process is due to the lack of measurements performed on production batches. Most of the production measuring steps occur in the photolithography area. In the photolithography area there are three sequential pr...
Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Departm...
Market forces are driving the semiconductor industry toward the generation of devices with progressi...
As semiconductor technology is aggressively scaling to finer feature sizes, manufacturing complexity...
Much of today’s high performance computing engines and hand-held mobile devices are products of aggr...
The increasingly stringent tolerance of linewidths is a result of shrinking feature size of integrat...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Photolithography in the semiconductor fabrication process is the core stage that determines the qual...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Maximizing productivity is one of the most critical factors for competitiveness in the manufacturing...
Extensive overload of data obtained from batch processes see the need for reduced dimensional analys...
Extensive overload of data obtained from batch processes see the need for reduced dimensional analys...
textSemiconductor manufacturing is characterized by a dynamic, varying environment and the technolog...
For a lithography process with a design rule of 0.18 um and beyond, the most critical issue is the g...
High reproducibility is desired to achieve high throughput in modern semiconductor manufacturing pro...
Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Departm...
Market forces are driving the semiconductor industry toward the generation of devices with progressi...
As semiconductor technology is aggressively scaling to finer feature sizes, manufacturing complexity...
Much of today’s high performance computing engines and hand-held mobile devices are products of aggr...
The increasingly stringent tolerance of linewidths is a result of shrinking feature size of integrat...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Photolithography in the semiconductor fabrication process is the core stage that determines the qual...
Present inspection techniques in the semiconductor industry are generally serial in nature. As a res...
Maximizing productivity is one of the most critical factors for competitiveness in the manufacturing...
Extensive overload of data obtained from batch processes see the need for reduced dimensional analys...
Extensive overload of data obtained from batch processes see the need for reduced dimensional analys...
textSemiconductor manufacturing is characterized by a dynamic, varying environment and the technolog...
For a lithography process with a design rule of 0.18 um and beyond, the most critical issue is the g...
High reproducibility is desired to achieve high throughput in modern semiconductor manufacturing pro...
Thesis: M. Eng. in Advanced Manufacturing and Design, Massachusetts Institute of Technology, Departm...
Market forces are driving the semiconductor industry toward the generation of devices with progressi...
As semiconductor technology is aggressively scaling to finer feature sizes, manufacturing complexity...