[[abstract]]Amorphous silicon has been produced on a single‐crystal silicon surface that was exposed to intense pulsed UV‐laser radiation at 266 nm. In addition, the formation of an oxide several tens of nanometers in thickness is observed when the irradiation takes place in an O2 or in an air ambient. Various experimental techniques including transmission electron microscopy, sputtered Auger electron spectroscopy, and differential Fourier‐transform IR spectroscopy have been employed to characterize the laser‐induced amorphous silicon and the oxide layer formed by this rapid melting and resolidification process. The present study suggests a new oxidation phenomena, namely, ’’laser‐induced oxidation.’’[[fileno]]2030182010029[[department]]電機工...
We present experimental and modeling studies of UV nanosecond pulsed laser desorption and ablation o...
We have applied ambient-pressure x-ray photoelectron spectroscopy with Si 2p chemical shifts to stud...
Films of 260nm thickness, with atomic composition Ta42Si13N45, on 4″ silicon wafers, have been irrad...
[[abstract]]Q‐switched laser irradiation has been used to anneal O+‐implanted silicon to form SiO2 l...
Oxidized Silicon nanomaterials produced by 1064 nm pulsed laser ablation in deionized water are inve...
International audienceIn this work, we present a comprehensive investigation of impurities contamina...
The growth of high quality silicon dioxide layers of thicknesses between a few 10's and a few 100's ...
Although laser-produced micro-/nano-structures have been extensively studied, the effects of the ini...
Using electron microscopy, atomic force microscopy, X-ray microanalysis, and IR spectroscopy, it was...
A new process to crystallize amorphous silicon without melting and the generation of excessive heati...
AbstractPure amorphous Si thin films deposited on oxidized crystalline Si surface (111) were crystal...
This thesis focused the understanding of the mechanisms responsible for different morphologies that ...
Si (100) with and without a 14–25 Å14–25Å thick native oxide was laser machined at grazing incidence...
Morphology changes introduced by picosecond laser pulses at λ = 532 nm and 355 nm in (111) and (100)...
Silicon hyperdoped with chalcogens via femtosecond-laser irradiation exhibits unique near-unity sub-...
We present experimental and modeling studies of UV nanosecond pulsed laser desorption and ablation o...
We have applied ambient-pressure x-ray photoelectron spectroscopy with Si 2p chemical shifts to stud...
Films of 260nm thickness, with atomic composition Ta42Si13N45, on 4″ silicon wafers, have been irrad...
[[abstract]]Q‐switched laser irradiation has been used to anneal O+‐implanted silicon to form SiO2 l...
Oxidized Silicon nanomaterials produced by 1064 nm pulsed laser ablation in deionized water are inve...
International audienceIn this work, we present a comprehensive investigation of impurities contamina...
The growth of high quality silicon dioxide layers of thicknesses between a few 10's and a few 100's ...
Although laser-produced micro-/nano-structures have been extensively studied, the effects of the ini...
Using electron microscopy, atomic force microscopy, X-ray microanalysis, and IR spectroscopy, it was...
A new process to crystallize amorphous silicon without melting and the generation of excessive heati...
AbstractPure amorphous Si thin films deposited on oxidized crystalline Si surface (111) were crystal...
This thesis focused the understanding of the mechanisms responsible for different morphologies that ...
Si (100) with and without a 14–25 Å14–25Å thick native oxide was laser machined at grazing incidence...
Morphology changes introduced by picosecond laser pulses at λ = 532 nm and 355 nm in (111) and (100)...
Silicon hyperdoped with chalcogens via femtosecond-laser irradiation exhibits unique near-unity sub-...
We present experimental and modeling studies of UV nanosecond pulsed laser desorption and ablation o...
We have applied ambient-pressure x-ray photoelectron spectroscopy with Si 2p chemical shifts to stud...
Films of 260nm thickness, with atomic composition Ta42Si13N45, on 4″ silicon wafers, have been irrad...