A Temperature-Aware Global Router

[[abstract]]In this thesis, we present a temperature-aware global router called NTHU-Route 3.0 that improves the reliability of interconnects by enhancing a state-of-the-art global router, NTHU-Route 2.0, with the following enhancements: (1) a temperature-aware L-shaped routing method employed during initial routing, (2) two temperature-aware cost functions employed during rip-up and reroute, and (3) three implementation techniques for memory reduction. The experimental results show that under two different types of thermal profiles our router can solve 12 of 16 ISPD08 benchmarks without causing any overflow, and also can generate comparable results in the other four benchmarks. In addition, our router can significantly reduce the number of net segments located in hot spots and thus enhance the chip reliability. Meanwhile, applying the memory reduction techniques, 45% of memory usage can be reduced on average.[[fileno]]2030229030045[[department]]資訊工程學