Add to ORKG[[abstract]]Data processing methods and computer display systems for computer aided design and electrical performance prediction of multilevel on-chip and off-chip interconnects. The invention specifically relates to parameterized graphical display and computation tools for calculation and display of capacitance and other electrical characteristics of multilevel VLSI, PCB, and MCM interconnects. Four subsystems are integrated: (a) a batch-mode computation module that combines a 2-D/3-D finite difference numerical simulation and a fast interpolation algorithm; (b) an interactive design mode with performance browsing, goal-directed synthesis, and on-line performance evaluation; (c) an interactive SPICE subcircuit generator and simulator; and ...
The rising complexity of interconnect and packaging structures in VLSI systems has increased the nec...
Abstract- An integrated interconnect modeling system, SIMS, is developed with the parametrized model...
[[abstract]]PC-based material is created for the analysis and design of circuits and electronics. A ...
[[abstract]]One of the challenges in VLSI fabrication is to design submicron multilevel metals with ...
We have developed a set of simulation programs for two- and three-dimensional analysis of interconne...
The electromagnetic modeling of packages and interconnects plays a very important role in the design...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
[[abstract]]This paper presents a new paradigm for fast and accurate 2-D and 3-D interconnect capaci...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
Disclosed are apparatus, methods and software that implement a partial element equivalent circuit (P...
This paper presents a new program package named CAP-CAL. It provides a method for calculation of the...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
Electrical machines are devices that change either mechanical or electrical energy to the other and ...
The rising complexity of interconnect and packaging structures in VLSI systems has increased the nec...
Abstract- An integrated interconnect modeling system, SIMS, is developed with the parametrized model...
[[abstract]]PC-based material is created for the analysis and design of circuits and electronics. A ...
[[abstract]]One of the challenges in VLSI fabrication is to design submicron multilevel metals with ...
We have developed a set of simulation programs for two- and three-dimensional analysis of interconne...
The electromagnetic modeling of packages and interconnects plays a very important role in the design...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
[[abstract]]This paper presents a new paradigm for fast and accurate 2-D and 3-D interconnect capaci...
[[abstract]]The authors describe a parameterized interconnect model library generator that provides ...
Disclosed are apparatus, methods and software that implement a partial element equivalent circuit (P...
This paper presents a new program package named CAP-CAL. It provides a method for calculation of the...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
VLSI interconnect capacitance is becoming more significant and also increasingly subject to process v...
Electrical machines are devices that change either mechanical or electrical energy to the other and ...
The rising complexity of interconnect and packaging structures in VLSI systems has increased the nec...
Abstract- An integrated interconnect modeling system, SIMS, is developed with the parametrized model...
[[abstract]]PC-based material is created for the analysis and design of circuits and electronics. A ...