[[abstract]]PROBLEM TO BE SOLVED: To manufacture a DRAM capacitor dielectric film having superior dielectric constant. SOLUTION: After a ditantalum pentoxide dielectric film 104 is deposited on a surface of a polysilicon accumulating electrode 102, is the ditantalum pentoxide dielectric film is subjected to two-stage process, and first a remote oxygen plasma process or an UV-ray ozone process is carried out, and next a spike annealing process is carried out. Thus, when the ditantalum pentoxide dielectric film is subjected to two-stage process, the first stage remote oxygen plasma is emitted at relatively lower temperature, and also as the required time of a second stage spike annealing process is extremely short, a thermal history of a manu...
We describe the formation of ultrathin tanta lum oxide capacitors, using rapid thermal nitridation o...
[[abstract]]The capacitor, e.g. of a DRAM cell, is formed by depositing a first layer of hemispheric...
Method and apparatus for forming thin silicon oxide films on silicon carbide substrates utilizing an...
[[abstract]]A method of fabricating a dielectric layer for a dynamic random access memory capacitor ...
[[abstract]]A method for forming a DRAM capacitor whose titanium nitride electrode is fabricated in ...
[[abstract]]A polysilicon layer is subsequently deposited on the dielectric layer by using CVD. Next...
[[abstract]]A semiconductor fabrication method is provided for the fabrication of a dielectric struc...
[[abstract]]A method for forming a dielectric-constant-enhanced capacitor is provided. A wafer in a ...
[[abstract]]A method of fabricating a DRAM capacitor uses tungsten nitride in the process of forming...
[[abstract]]A method for manufacturing the lower electrode of a DRAM capacitor. The method includes ...
[[abstract]]An integrated circuit device having both an array of logic circuits and embedded DRAM ci...
[[abstract]]A method of forming a DRAM includes forming a transfer FET on a substrate, the FET havin...
[[abstract]]A method for fabricating a capacitor of a DRAM includes a lower conductive layer of the ...
[[abstract]]A dielectric layer in a dual-damascene interconnect is described. A dual-damascene inter...
[[abstract]]A high capacitance charge storage capacitor for a DRAM has a lower electrode in contact ...
We describe the formation of ultrathin tanta lum oxide capacitors, using rapid thermal nitridation o...
[[abstract]]The capacitor, e.g. of a DRAM cell, is formed by depositing a first layer of hemispheric...
Method and apparatus for forming thin silicon oxide films on silicon carbide substrates utilizing an...
[[abstract]]A method of fabricating a dielectric layer for a dynamic random access memory capacitor ...
[[abstract]]A method for forming a DRAM capacitor whose titanium nitride electrode is fabricated in ...
[[abstract]]A polysilicon layer is subsequently deposited on the dielectric layer by using CVD. Next...
[[abstract]]A semiconductor fabrication method is provided for the fabrication of a dielectric struc...
[[abstract]]A method for forming a dielectric-constant-enhanced capacitor is provided. A wafer in a ...
[[abstract]]A method of fabricating a DRAM capacitor uses tungsten nitride in the process of forming...
[[abstract]]A method for manufacturing the lower electrode of a DRAM capacitor. The method includes ...
[[abstract]]An integrated circuit device having both an array of logic circuits and embedded DRAM ci...
[[abstract]]A method of forming a DRAM includes forming a transfer FET on a substrate, the FET havin...
[[abstract]]A method for fabricating a capacitor of a DRAM includes a lower conductive layer of the ...
[[abstract]]A dielectric layer in a dual-damascene interconnect is described. A dual-damascene inter...
[[abstract]]A high capacitance charge storage capacitor for a DRAM has a lower electrode in contact ...
We describe the formation of ultrathin tanta lum oxide capacitors, using rapid thermal nitridation o...
[[abstract]]The capacitor, e.g. of a DRAM cell, is formed by depositing a first layer of hemispheric...
Method and apparatus for forming thin silicon oxide films on silicon carbide substrates utilizing an...