Creating a Microplasma Discharge Using an RF Generated Plasma Source

A device is needed that will withstand harsh environments because normal semiconductors are incapable of functioning at high temperatures (\u3e 150 C) and in high radiation environment. Microplasma based devices are being developed for this purpose. The device consists of a slit structure in a dielectric material. The slits range in size from 0.3 to 1.2 mm. Device fabrication includes Low Temperature Co-fired Ceramic (LTCC), which contains an Radio-Frequency (RF) antenna and three DC terminals. The RF antenna operates from 800 to 1000 MHz. The DC terminals serve the same purpose as in a normal transistor. Results of the experimental measurements of the device Current-Voltage characteristics will be presented for a range of gas pressures, RF powers, and slit dimensions