[[abstract]]Recognizing that speed, size, reliability, and cost are the principal driving forces for advanced electronic packages, this review article describes the much needed development of a new, phase transformation-free, single-phase silica dielectric with a dielectric constant (k) of about 4, the lowest among the inorganic oxides, and a coefficient of thermal expansion (CTE) of about 3 ppm/°C, similar to that of Si. This dielectric, consisting largely of SiO2, represents a gain in media speed by about 50% over alumina dielectric, combined with an improvement in reliability of the package by a factor of about 1000. The feature size and system cost can also be drastically reduced by using this dielectric. It is made from a mixture of bi...
The authors report on the investigation of amorphous Gd-based silicates as high- k dielectrics. Two ...
Advances in telecommunications require electronics that operate at ever-increasing frequencies, exem...
[[abstract]]A crystallizable ceramic composition for forming a ceramic dielectric body having a diel...
[[abstract]]Compositional design and properties of a low-dielectric-constant silica composite contai...
[[abstract]]In current microelectronics packaging applications, low-temperature fired substrates wit...
Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize t...
[[abstract]]Integration of organosilicate glass (OSG) and organofluorinated silicate glass (OFSG) lo...
Since the application of silicon materials in electronic devices in the 1950s, microprocessors are c...
[[abstract]]Compositional design and properties of a low dielectric constant glass+ceramics, contain...
We have investigated the crystallization of amorphous oxides that are considered likely candidates t...
Glass-ceramic composites that have sintering temperatures below 1050 C are of global importance by t...
The exponential growth of the silicon industry can be attributed to that fact that silicon has a nat...
At 0.18 microns and below minimum device dimensions in Ultra Large Scale Integrated Circuits, signal...
Fused silica ceramics is a special group among the materials used to obtain refractory products. The...
The crystallization of amorphous oxides was investigated. These oxides are considered likely candida...
The authors report on the investigation of amorphous Gd-based silicates as high- k dielectrics. Two ...
Advances in telecommunications require electronics that operate at ever-increasing frequencies, exem...
[[abstract]]A crystallizable ceramic composition for forming a ceramic dielectric body having a diel...
[[abstract]]Compositional design and properties of a low-dielectric-constant silica composite contai...
[[abstract]]In current microelectronics packaging applications, low-temperature fired substrates wit...
Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize t...
[[abstract]]Integration of organosilicate glass (OSG) and organofluorinated silicate glass (OFSG) lo...
Since the application of silicon materials in electronic devices in the 1950s, microprocessors are c...
[[abstract]]Compositional design and properties of a low dielectric constant glass+ceramics, contain...
We have investigated the crystallization of amorphous oxides that are considered likely candidates t...
Glass-ceramic composites that have sintering temperatures below 1050 C are of global importance by t...
The exponential growth of the silicon industry can be attributed to that fact that silicon has a nat...
At 0.18 microns and below minimum device dimensions in Ultra Large Scale Integrated Circuits, signal...
Fused silica ceramics is a special group among the materials used to obtain refractory products. The...
The crystallization of amorphous oxides was investigated. These oxides are considered likely candida...
The authors report on the investigation of amorphous Gd-based silicates as high- k dielectrics. Two ...
Advances in telecommunications require electronics that operate at ever-increasing frequencies, exem...
[[abstract]]A crystallizable ceramic composition for forming a ceramic dielectric body having a diel...