TRANSIENT THERMAL-STRESS ANALYSIS OF A NEAR-EDGE ELLIPTIC DEFECT IN A SEMIINFINITE PLATE SUBJECTED TO A MOVING HEAT-SOURCE

[[abstract]]In this paper, the maximum transient thermal stresses on the boundary of a near-edge elliptical defect in a semi-infinite thin plate were determined by the digital photoelastic technique, when the plate edge experiences a moving heat source. The relationships between the maximum transient thermal stresses and the size and inclination of the elliptical defect, the minimum distance from the elliptical defect to the plate edge as well as the speed of the moving heat source were also studied. Finally, by using a statistical analysis package, the variations of the maximum transient thermal stresses were then correlated with the time, the minimum distance between the edge and the elliptical defect, temperature difference, and speed of the moving heat source.[[fileno]]2020228010032[[department]]動機