Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter

[[abstract]]It is convenient to characterize thin film material properties using commercially available nanoindentation systems. This study aims to discuss several considerations while determining the thin film elastic modulus by means of a microcantilever bending test using a commercial nanoindentation system. The measurement results are significantly improved after: 1. the indentation of the film during the test is considered and corrected, and 2. the boundary effects are considered in the model by finite element method. In application, the elastic modulus of electroplating nickel film 11 mu m thick was characterized.[[fileno]]2020218010049[[department]]動機