[[abstract]]A poly-Si gate electrode formed by amorphous-Si film is proposed and demonstrated to improve the radiation hardness in MOS capacitors. The improvement of radiation hardness is due to the increase of compressive stress in the oxide. As little change in the device fabrication process is required, it should be useful in practice.[[fileno]]2060110010046[[department]]工程與系統科學
[[abstract]]The influence of process condition on the resistivity of the arsenic-doped polysilicon e...
SiGe alloys are currently used for HBT and MOS as epitaxial layers for base or strained channel, res...
Low pressure chemically vapor deposited polysilicon deposition was studied from 525 to 650 ~ The sil...
[[abstract]]In this letter, we investigate the radiation hardness of metal-oxide-semiconductor (MOS)...
Since 40 years microlectronics has always been evolving following the Moore's Law rhythm thanks to t...
The work function of polycrystalline nickel silicide film formed by rapid thermal annealing (RTA) ha...
Abstract- This letter reports that the boron penetration through the thin gate oxide into the Si sub...
\u3cp\u3eThe use of amorphously deposited silicon and fine-grained polysilicon as MOS gate material ...
Thick silicon films with good electronic quality have been prepared by glow discharge of He-diluted ...
The properties of TiSi3 silicide thin films produced either by reaction or by sputtering have been i...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
Thick silicon films with good electronic quality have been prepared by glow discharge of He-diluted ...
The total dose effect of 60Co gamma-irradiation on MOS (metal-oxide-semiconductor) structure of Al/S...
The development of new materials and processes for electronic devices has been driven by the integra...
Electrical properties of MOS capacitors using MOCVD HfO2 as gate dielectric have been investigated. ...
[[abstract]]The influence of process condition on the resistivity of the arsenic-doped polysilicon e...
SiGe alloys are currently used for HBT and MOS as epitaxial layers for base or strained channel, res...
Low pressure chemically vapor deposited polysilicon deposition was studied from 525 to 650 ~ The sil...
[[abstract]]In this letter, we investigate the radiation hardness of metal-oxide-semiconductor (MOS)...
Since 40 years microlectronics has always been evolving following the Moore's Law rhythm thanks to t...
The work function of polycrystalline nickel silicide film formed by rapid thermal annealing (RTA) ha...
Abstract- This letter reports that the boron penetration through the thin gate oxide into the Si sub...
\u3cp\u3eThe use of amorphously deposited silicon and fine-grained polysilicon as MOS gate material ...
Thick silicon films with good electronic quality have been prepared by glow discharge of He-diluted ...
The properties of TiSi3 silicide thin films produced either by reaction or by sputtering have been i...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
Thick silicon films with good electronic quality have been prepared by glow discharge of He-diluted ...
The total dose effect of 60Co gamma-irradiation on MOS (metal-oxide-semiconductor) structure of Al/S...
The development of new materials and processes for electronic devices has been driven by the integra...
Electrical properties of MOS capacitors using MOCVD HfO2 as gate dielectric have been investigated. ...
[[abstract]]The influence of process condition on the resistivity of the arsenic-doped polysilicon e...
SiGe alloys are currently used for HBT and MOS as epitaxial layers for base or strained channel, res...
Low pressure chemically vapor deposited polysilicon deposition was studied from 525 to 650 ~ The sil...