[[abstract]]The mechanism and the optimization of nitrogen implantation for suppression the boron penetration in p(+)-poly-Si gate metal-oxide-semiconductor capacitor is reported. This nitrogen co-implantation process exhibits a good suppression of boron penetration and a better electrical characteristic than that of control sample. It was found that nitrogen combines with the boron to form a B-N complex, retarding the penetration of boron itself, was identified by XPS measurements. The optimum nitrogen dosage is also found in this study.[[fileno]]2020412010011[[department]]工工
The effects of fluorine and nitrogen incorporation on ultra-thin gate oxide integrity (GOI) were inv...
[[abstract]]To form an ultra-shallow p(+)-n junction by direct low energy BF2+ implantation is diffi...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...
PMOS devices with and without nitrogen implant into the gate electrode before doping with boron and ...
To suppress boron impurities' diffusion into channel, nitrogen implantation into polysilicon ga...
[[abstract]]A comprehensive study of the phosphorus dosage and annealing condition dependencies of b...
Abstruct- NH3-nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-S...
[[abstract]]Both of the nitrogen implantation and threshold-voltage adjustment implantation introduc...
[[abstract]]To reduce the boron penetration and improve the Fowler-Nordheim (FN) stress hardness sim...
This paper discusses boron doping using metal oxide semiconductor structure (poly-Si/SiOs/Si). The t...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
International audienceIn this work we propose, the study of nitrogen doped Silicon films for an appl...
The incorporation of nitrogen in silicon has been shown to retard the oxidation growth rate. The pre...
Neste trabalho foram fabricados e caracterizados eletricamente capacitores MOS com óxido de silício ...
Due to the aggressive scaling of CMOS devices, it is necessary to provide a metal gate solution to r...
The effects of fluorine and nitrogen incorporation on ultra-thin gate oxide integrity (GOI) were inv...
[[abstract]]To form an ultra-shallow p(+)-n junction by direct low energy BF2+ implantation is diffi...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...
PMOS devices with and without nitrogen implant into the gate electrode before doping with boron and ...
To suppress boron impurities' diffusion into channel, nitrogen implantation into polysilicon ga...
[[abstract]]A comprehensive study of the phosphorus dosage and annealing condition dependencies of b...
Abstruct- NH3-nitridation to create nitrogen-rich layers in-between the stacked layers of the poly-S...
[[abstract]]Both of the nitrogen implantation and threshold-voltage adjustment implantation introduc...
[[abstract]]To reduce the boron penetration and improve the Fowler-Nordheim (FN) stress hardness sim...
This paper discusses boron doping using metal oxide semiconductor structure (poly-Si/SiOs/Si). The t...
Abstract-A method of using a thin oxide on the top of the poly-Si gate to getter fluorine for BF; in...
International audienceIn this work we propose, the study of nitrogen doped Silicon films for an appl...
The incorporation of nitrogen in silicon has been shown to retard the oxidation growth rate. The pre...
Neste trabalho foram fabricados e caracterizados eletricamente capacitores MOS com óxido de silício ...
Due to the aggressive scaling of CMOS devices, it is necessary to provide a metal gate solution to r...
The effects of fluorine and nitrogen incorporation on ultra-thin gate oxide integrity (GOI) were inv...
[[abstract]]To form an ultra-shallow p(+)-n junction by direct low energy BF2+ implantation is diffi...
[[abstract]]High-k gate dielectric process is the key technology for nano-scale MOS device. A nitrid...