[[abstract]]© 1996 Elsevier-The formation of bottom oxide by electrochemical oxidation in porous silicon layers is studied. A technique of controlling the oxide layer thickness is developed. It is shown that the design of the anodization current level and of the porous silicon texture is an effective method for oxide formation control[[department]]電機工程學
Electrochemical oxidation of silicon (p-type Si(100)) at room temperature in ethylene glycol and in ...
The influence of the first stages of anodic oxidation of p-Si on the mechanism of Co deposition was ...
Silicon dioxide (SiO2) thin films are most commonly used insulating films in the fabrication of sili...
[[abstract]]© 1996 Elsevier-In this paper, techniques for controlling the growth of the bottom oxide...
[[abstract]]In this paper, techniques for controlling the growth of the bottom oxide formed by simpl...
Background. In modern microelectronics, silicon remains the main material in the production of semi...
application/pdfAnodic oxide films were formed on comparatively small area of silicon substrates. Con...
The porous silicon layer as the passivation coating for high voltage devices is proposed. PS layers ...
Porous silicon layers were formed on a p-type silicon wafers by electrochemical anodisation. Depende...
The set up used to grow silicon dioxide anodically on silicon surface has been described and the res...
The mechanism of formation of porous silicon layer (PSL) has been studied according to the following...
AbstractAluminum oxide and zinc oxide coatings of automatic high precision thickness control in the ...
The paper reports data on the kinetics of anodic oxide films growth on silicon in aqueous solutions ...
The electrochemical processes occurring during anodization of low resis-tivity silicon were studied ...
Electrochemical anodization in the transition regime, between porous silicon formation region and el...
Electrochemical oxidation of silicon (p-type Si(100)) at room temperature in ethylene glycol and in ...
The influence of the first stages of anodic oxidation of p-Si on the mechanism of Co deposition was ...
Silicon dioxide (SiO2) thin films are most commonly used insulating films in the fabrication of sili...
[[abstract]]© 1996 Elsevier-In this paper, techniques for controlling the growth of the bottom oxide...
[[abstract]]In this paper, techniques for controlling the growth of the bottom oxide formed by simpl...
Background. In modern microelectronics, silicon remains the main material in the production of semi...
application/pdfAnodic oxide films were formed on comparatively small area of silicon substrates. Con...
The porous silicon layer as the passivation coating for high voltage devices is proposed. PS layers ...
Porous silicon layers were formed on a p-type silicon wafers by electrochemical anodisation. Depende...
The set up used to grow silicon dioxide anodically on silicon surface has been described and the res...
The mechanism of formation of porous silicon layer (PSL) has been studied according to the following...
AbstractAluminum oxide and zinc oxide coatings of automatic high precision thickness control in the ...
The paper reports data on the kinetics of anodic oxide films growth on silicon in aqueous solutions ...
The electrochemical processes occurring during anodization of low resis-tivity silicon were studied ...
Electrochemical anodization in the transition regime, between porous silicon formation region and el...
Electrochemical oxidation of silicon (p-type Si(100)) at room temperature in ethylene glycol and in ...
The influence of the first stages of anodic oxidation of p-Si on the mechanism of Co deposition was ...
Silicon dioxide (SiO2) thin films are most commonly used insulating films in the fabrication of sili...