[[abstract]]©2006 MRS - Interfacial reactions in γ-InSn4(Sn-20 at.% In)/Ni couples at 130, 140, 150, and 160 °C were investigated. Ni3Sn4 phase with significant indium solubility was formed in the couple reacted at 130 and 140 °C, and the reaction path was γ-InSn4/Ni3Sn4/Ni. For the couples reacted at 150 and 160 °C, even though both γ-InSn4 and Ni were solid phases, the liquid phase was formed in the couples. A distinguished feature was the nickel substrates becoming nonplanar with spikes at various locations and the Ni3Sn4 phase layer on top of the nickel spikes. Except at regions near the nickel spikes, the reaction layer consisted of precipitates and was not a homogeneous phase. The reaction path is γ...
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu s...
[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys wer...
Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systema...
[[abstract]]c2002 Springer - The In-Sn-Ni alloys of various compositions were prepared and annealed ...
[[abstract]]©2003 MRS - Sn/Ni interfacial reactions at 100 °C with and without the passage of el...
[[abstract]]c2006 Springer - Ni-7wt.%V(8at.%V) is an important under bump metallization material, an...
International audienceInterfacial reactions are investigated between electrochemical deposited Sn-2 ...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
[[abstract]]©2006 Springer - Ni-7wt.%V is commonly used as the barrier layer material in the under-b...
[[abstract]]©2007 Elsevier - In the early stage of the Sn/Ni-7 wt.%V reaction at 200 °C, solid s...
The interfacial microstructure of electroless Ni-P/Sn-3.5Ag solder joints was investigated after ref...
In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize ...
[[abstract]]c2007 Springer - The Delco process is a major flip chip under-bump metallurgy process an...
Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metall...
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu s...
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu s...
[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys wer...
Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systema...
[[abstract]]c2002 Springer - The In-Sn-Ni alloys of various compositions were prepared and annealed ...
[[abstract]]©2003 MRS - Sn/Ni interfacial reactions at 100 °C with and without the passage of el...
[[abstract]]c2006 Springer - Ni-7wt.%V(8at.%V) is an important under bump metallization material, an...
International audienceInterfacial reactions are investigated between electrochemical deposited Sn-2 ...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
[[abstract]]©2006 Springer - Ni-7wt.%V is commonly used as the barrier layer material in the under-b...
[[abstract]]©2007 Elsevier - In the early stage of the Sn/Ni-7 wt.%V reaction at 200 °C, solid s...
The interfacial microstructure of electroless Ni-P/Sn-3.5Ag solder joints was investigated after ref...
In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize ...
[[abstract]]c2007 Springer - The Delco process is a major flip chip under-bump metallurgy process an...
Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metall...
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu s...
Solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu s...
[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys wer...
Effects of Zn addition on the interfacial reaction between Sn and Ni(P) were investigated by systema...