[[abstract]]c2003 Springer - Wetting and interfacial reactions occurred when molten Sn-Bi alloys were in contact with a Ni substrate. Wetting properties of Sn-Bi alloys on the Ni substrate and their interfacial reactions were examined, and the effects of interfacial reactions on wetting properties were discussed. Couples made of various molten Sn-Bi alloys and Ni substrates were reacted at 300°C. It was found that, when the Bi content was greater than 98 wt.%, the intermetallic phase formed at the interface was NiBi3 phase. The Ni3Sn4 phase was found in the other Sn-Bi/Ni couples that had Bi contents varied from 92 wt.% to 97.5 wt.%. An isothermal section at 300°C for the ternary Sn-Bi-Ni system was proposed to illustrate the reaction paths...
It is shown that dissolutive wetting initially yields a metastable equilibrium. A compact model for ...
The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are dis...
The wetting behavior of a new Sn-Bi-Cu Pb-free solder on Cu substrate was investigated by sessile dr...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wettin...
Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessil...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
International audienceThe wetting of Cu-Fe two-phase composites by molten Sn is studied by the sessi...
International audienceInterfacial reactions are investigated between electrochemical deposited Sn-2 ...
The surface tension of molten Sn-Bi (mole fraction X-Bi = 0.455) alloy has been determined by the se...
Bi-x wt.%Sn alloys (x = 2, 5, 10) were joined with Cu substrates and reacted at 300 C to investigate...
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile d...
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile d...
It is shown that dissolutive wetting initially yields a metastable equilibrium. A compact model for ...
The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are dis...
The wetting behavior of a new Sn-Bi-Cu Pb-free solder on Cu substrate was investigated by sessile dr...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wettin...
Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessil...
Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests...
International audienceThe wetting of Cu-Fe two-phase composites by molten Sn is studied by the sessi...
International audienceInterfacial reactions are investigated between electrochemical deposited Sn-2 ...
The surface tension of molten Sn-Bi (mole fraction X-Bi = 0.455) alloy has been determined by the se...
Bi-x wt.%Sn alloys (x = 2, 5, 10) were joined with Cu substrates and reacted at 300 C to investigate...
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile d...
The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile d...
It is shown that dissolutive wetting initially yields a metastable equilibrium. A compact model for ...
The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are dis...
The wetting behavior of a new Sn-Bi-Cu Pb-free solder on Cu substrate was investigated by sessile dr...