[[abstract]]c2002 Springer - The In-Sn-Ni alloys of various compositions were prepared and annealed at 160°C and 240°C. No ternary compounds were found; however, most of the binary compounds had extensive ternary solubility. There was a continuous solid solution between the Ni3Sn phase and Ni3In phase. The Sn-In/Ni couples, made of Sn-In alloys with various compositions, were reacted at 160°C and 240°C and formed only one compound for all the Sn-In alloys/Ni couples reacted up to 8 h. At 240°C, Ni28In72 phase formed in the couples made with pure indium, In-10at.%Sn and In-11at.%Sn alloys, while Ni3Sn4 phase formed in the couples made of alloys with compositions varied from pure Sn to In-12at.%Sn. At 160°C, except in the In/Ni couple, Ni3Sn4...
[[abstract]]©2006 Springer - Ni-7wt.%V is commonly used as the barrier layer material in the under-b...
AbstractTernary Sn–Zn–Ni alloys were prepared and equilibrated at 250 °C for 4–15 weeks. The phases ...
The interfacial reactions between SnxZn1-x alloys and Ni substrate were experimentally investigated ...
[[abstract]]©2006 MRS - Interfacial reactions in γ-InSn4(Sn-20 at.% In)/Ni couples at 130, 140...
[[abstract]]©2004 Elsevier - There are no previous phase equilibria studies of the Sn-Ag-Ni ternary ...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
This study focuses on the characterization of the Ni/In/Cu microstructure. Ni and Cu are chosen beca...
The phase equilibria of the ternary system In–Ni–Sn were investigated experimentally at 700 °C using...
[[abstract]]c2003 Springer - The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for va...
AbstractThe phase equilibria of the ternary system In–Ni–Sn were investigated experimentally at 700 ...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
The limitation of the harmful lead-containing solders used in the electronics and other industry ...
[[abstract]]©2006 Springer - Ni-7wt.%V is commonly used as the barrier layer material in the under-b...
AbstractTernary Sn–Zn–Ni alloys were prepared and equilibrated at 250 °C for 4–15 weeks. The phases ...
The interfacial reactions between SnxZn1-x alloys and Ni substrate were experimentally investigated ...
[[abstract]]©2006 MRS - Interfacial reactions in γ-InSn4(Sn-20 at.% In)/Ni couples at 130, 140...
[[abstract]]©2004 Elsevier - There are no previous phase equilibria studies of the Sn-Ag-Ni ternary ...
[[abstract]]c2003 Springer - Specimens with the Sn/Cu/Sn/Ni/Sn/Cu/Sn structure reacted at 200°C are ...
This study focuses on the characterization of the Ni/In/Cu microstructure. Ni and Cu are chosen beca...
The phase equilibria of the ternary system In–Ni–Sn were investigated experimentally at 700 °C using...
[[abstract]]c2003 Springer - The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200°C for va...
AbstractThe phase equilibria of the ternary system In–Ni–Sn were investigated experimentally at 700 ...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of thei...
The limitation of the harmful lead-containing solders used in the electronics and other industry ...
[[abstract]]©2006 Springer - Ni-7wt.%V is commonly used as the barrier layer material in the under-b...
AbstractTernary Sn–Zn–Ni alloys were prepared and equilibrated at 250 °C for 4–15 weeks. The phases ...
The interfacial reactions between SnxZn1-x alloys and Ni substrate were experimentally investigated ...