[[abstract]]©2003 Wiley - The effects of molecular weight and molecular structure of styrene(St) based and vinyl acetate(VAc)-based low-profile additive (LPA) on the curing kinetics and compatibility of unsaturated polyester (UP)/LPA system and linear shrinkage, water absorption rate, surface gloss and pigmentability of bulk molding compound (BMC) were investigated. Results show that the curing reaction rate decreases with an increase of the molecular weight of LPA due to the chain entanglement effect. The plasticizing effect of LPA on the (UP) network was reduced with an increase of the molecular weight of LPA. Water absorption of BMC increases as the molecular weight of LPA increases, implying that more microvoids were formed inside the B...
Two water-reducible polymers were synthesized by free-radical polymerization. A low molecular weight...
Injection moulded micro parts and microstructured surfaces require accurate replication of micro-sca...
ABSTRACT: Silica filled epoxy resins as encapsulation in chip packages reveal a major influence on t...
The effects of four low-profile additives (LPAs) namely poly (vinyl acetate) (PVAc),poly (methyl met...
Resin dimensional changes, including cure shrinkage and thermal expansion, highly influence the surf...
Resin transfer molding (RTM) has great potential to become an efficient and economical process for f...
For unsaturated polyester resins combined with thermoplastic resins, microstructure nd volume change...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
Vinyl esters combine the best of polyesters and epoxies in terms of properties and processing. Witho...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
Theoretical part of bachelor’s thesis deals with composite materials based on fiberglass and unsatur...
Two water-reducible polymers were synthesized by free-radical polymerization. A low molecular weight...
Injection moulded micro parts and microstructured surfaces require accurate replication of micro-sca...
ABSTRACT: Silica filled epoxy resins as encapsulation in chip packages reveal a major influence on t...
The effects of four low-profile additives (LPAs) namely poly (vinyl acetate) (PVAc),poly (methyl met...
Resin dimensional changes, including cure shrinkage and thermal expansion, highly influence the surf...
Resin transfer molding (RTM) has great potential to become an efficient and economical process for f...
For unsaturated polyester resins combined with thermoplastic resins, microstructure nd volume change...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
Vinyl esters combine the best of polyesters and epoxies in terms of properties and processing. Witho...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
International audienceThis article describes the solvolysis of sheet-molding composites (SMC) consis...
Theoretical part of bachelor’s thesis deals with composite materials based on fiberglass and unsatur...
Two water-reducible polymers were synthesized by free-radical polymerization. A low molecular weight...
Injection moulded micro parts and microstructured surfaces require accurate replication of micro-sca...
ABSTRACT: Silica filled epoxy resins as encapsulation in chip packages reveal a major influence on t...