Copper thin film of alternating textures

A novel method for the metallization of 3D silicon induced by metastable copper nanoparticles

Cure, Jérémy
Piettre, Kilian
Sournia-Saquet, Alix
Coppel, Yannick
Esvan, Jérôme
Chaudret, Bruno
Fau, Pierre

January 2018

International audienceThe development of efficient copper deposition processes in high-aspect-ratio ...

Growth front roughening of room-temperature deposited copper nanocluster films

Palasantzas, G.
Koch, S. A.
de Hosson, J. Th. M.

August 2002

Growth front aspects of copper nanocluster films deposited with low energy onto silicon substrates a...

Microstructural Evolution in Thin Films of Electronic Materials

Thompson, Carl V.
Frost, Harold J.
Floro, Jerrold A.
Liu, Yachin
Cho, Jaeshin
Kahn, Harold
Longworth, Hai P.
Smith, Henry I.
Palmer, Joyce E.
Burns, Geoffrey F.
Fonstad, Clifton G.
Clevenger, Lawrence A.
Ma, En
DeAvillez, Roberto R.
Tu, King-Ning
Evans, Paul
Im, James S.
Chen, Chenson K.
Jiran, Eva
Ro, Jaesang
Dubner, Andrew D.
Melngailis, John
Edell, David J.

Contains reports on ten research projects.Joint Services Electronics Program Contract DAAL03-89-C-00...

Copper thin film of alternating textures

Huang, HC
Wei, HL
Woo, CH
Zhang, XX

January 2003

It is common for thin films to have a predominant texture, but not alternating textures. In this let...

Development of 〈110〉 texture in copper thin films

Wei, HL
Huang, H
Woo, CH
Zheng, RK
Wen, GH
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2001-2002 > Academic research: refereed > Publication...

Development of < 110 > texture in copper thin films

Wei, HL
Huang, HC
Woo, CH
Zheng, RK
Wen, GH
Zhang, XX

January 2002

Apart from the scientific interest, texture development in copper thin films is of crucial importanc...

Mechanism of texture formation in submicron Cu thin films

X.W. Peng
L. Chen
K.X. Song

November 2021

We successfully fabricated the submicron Cu thin films with different texture components and thickne...

Engineering kinetic barriers in copper metallization

Huang, H
Wei, HL
Woo, CH
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...

A relationship between film texture and stress-voiding tendency in Copper thin films

Koike J.
Sekiguchi A.
Wada M.
Maruyama K.

September 2011

科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究

Atomic layer chemical vapour deposition of copper

Mane, Anil U
Shivashankar, SA

October 2004

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We ...

On the effect of copper as wetting agent during growth of thin silver films on silicon dioxide substrates

Jamnig, Andreas
Pliatsikas, Nikolaos
Abadias, Grégory
Sarakinos, Kostas

January 2021

We study the effect of Cu incorporation on the morphological evolution and the optoelectronic proper...

Kinetics-limited surface structures at the nanoscale

Huang, H
Woo, CH
Wei, HL
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...

Physical investigation of copper thin film prepared by sputtering

Drize, Abbas
Settaouti, Abderrahmane

June 2018

Copper thin films have been deposited by sputtering. The simulation results show that most of depos...

Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements

SALVATO, MATTEO
Aurigemma, A.
Tesauro, A.
Attanasio, C.

January 2008

Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different ...

Effect of Film Thickness on the Evolution of Annealing Texture in Sputtered Copper Films

P. R. Besser

January 2005

Microstructural evolution during elevated temperature annealing of sputter deposited copper (Cu) fil...

A novel method for the metallization of 3D silicon induced by metastable copper nanoparticles

Cure, Jérémy
Piettre, Kilian
Sournia-Saquet, Alix
Coppel, Yannick
Esvan, Jérôme
Chaudret, Bruno
Fau, Pierre

January 2018

International audienceThe development of efficient copper deposition processes in high-aspect-ratio ...

Growth front roughening of room-temperature deposited copper nanocluster films

Palasantzas, G.
Koch, S. A.
de Hosson, J. Th. M.

August 2002

Growth front aspects of copper nanocluster films deposited with low energy onto silicon substrates a...

Microstructural Evolution in Thin Films of Electronic Materials

Thompson, Carl V.
Frost, Harold J.
Floro, Jerrold A.
Liu, Yachin
Cho, Jaeshin
Kahn, Harold
Longworth, Hai P.
Smith, Henry I.
Palmer, Joyce E.
Burns, Geoffrey F.
Fonstad, Clifton G.
Clevenger, Lawrence A.
Ma, En
DeAvillez, Roberto R.
Tu, King-Ning
Evans, Paul
Im, James S.
Chen, Chenson K.
Jiran, Eva
Ro, Jaesang
Dubner, Andrew D.
Melngailis, John
Edell, David J.

Contains reports on ten research projects.Joint Services Electronics Program Contract DAAL03-89-C-00...

Copper thin film of alternating textures

Huang, HC
Wei, HL
Woo, CH
Zhang, XX

January 2003

It is common for thin films to have a predominant texture, but not alternating textures. In this let...

Development of 〈110〉 texture in copper thin films

Wei, HL
Huang, H
Woo, CH
Zheng, RK
Wen, GH
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2001-2002 > Academic research: refereed > Publication...

Development of < 110 > texture in copper thin films

Wei, HL
Huang, HC
Woo, CH
Zheng, RK
Wen, GH
Zhang, XX

January 2002

Apart from the scientific interest, texture development in copper thin films is of crucial importanc...

Mechanism of texture formation in submicron Cu thin films

X.W. Peng
L. Chen
K.X. Song

November 2021

We successfully fabricated the submicron Cu thin films with different texture components and thickne...

Engineering kinetic barriers in copper metallization

Huang, H
Wei, HL
Woo, CH
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...

A relationship between film texture and stress-voiding tendency in Copper thin films

Koike J.
Sekiguchi A.
Wada M.
Maruyama K.

September 2011

科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究

Atomic layer chemical vapour deposition of copper

Mane, Anil U
Shivashankar, SA

October 2004

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We ...

On the effect of copper as wetting agent during growth of thin silver films on silicon dioxide substrates

Jamnig, Andreas
Pliatsikas, Nikolaos
Abadias, Grégory
Sarakinos, Kostas

January 2021

We study the effect of Cu incorporation on the morphological evolution and the optoelectronic proper...

Kinetics-limited surface structures at the nanoscale

Huang, H
Woo, CH
Wei, HL
Zhang, XX

December 2014

Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...

Physical investigation of copper thin film prepared by sputtering

Drize, Abbas
Settaouti, Abderrahmane

June 2018

Copper thin films have been deposited by sputtering. The simulation results show that most of depos...

Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements

SALVATO, MATTEO
Aurigemma, A.
Tesauro, A.
Attanasio, C.

January 2008

Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different ...

Effect of Film Thickness on the Evolution of Annealing Texture in Sputtered Copper Films

P. R. Besser

January 2005

Microstructural evolution during elevated temperature annealing of sputter deposited copper (Cu) fil...

A novel method for the metallization of 3D silicon induced by metastable copper nanoparticles

Cure, Jérémy
Piettre, Kilian
Sournia-Saquet, Alix
Coppel, Yannick
Esvan, Jérôme
Chaudret, Bruno
Fau, Pierre

January 2018

International audienceThe development of efficient copper deposition processes in high-aspect-ratio ...

Growth front roughening of room-temperature deposited copper nanocluster films

Palasantzas, G.
Koch, S. A.
de Hosson, J. Th. M.

August 2002

Growth front aspects of copper nanocluster films deposited with low energy onto silicon substrates a...

Microstructural Evolution in Thin Films of Electronic Materials

Thompson, Carl V.
Frost, Harold J.
Floro, Jerrold A.
Liu, Yachin
Cho, Jaeshin
Kahn, Harold
Longworth, Hai P.
Smith, Henry I.
Palmer, Joyce E.
Burns, Geoffrey F.
Fonstad, Clifton G.
Clevenger, Lawrence A.
Ma, En
DeAvillez, Roberto R.
Tu, King-Ning
Evans, Paul
Im, James S.
Chen, Chenson K.
Jiran, Eva
Ro, Jaesang
Dubner, Andrew D.
Melngailis, John
Edell, David J.

Contains reports on ten research projects.Joint Services Electronics Program Contract DAAL03-89-C-00...

Copper thin film of alternating textures

Abstract

Extracted data

Copper thin film of alternating textures

Abstract

Extracted data

Related items

Related items