Author name used in this publication: C. H. Woo2001-2002 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Thins films are deposited on bulk materials to attain properties which are superior to the parent su...
Copper thin films have been deposited by sputtering. The simulation results show that most of depos...
Copper has become the metal of choice for metallization, owing to its high electrical and thermal co...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
Apart from the scientific interest, texture development in copper thin films is of crucial importanc...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We ...
Thin copper films have various application in the electronic industry for the fabrication of contac...
We successfully fabricated the submicron Cu thin films with different texture components and thickne...
Texture in films develops during deposition processes and annealing of patterned wafers. Recent stud...
Copper interconnects in microelectronics have long been plagued with thermo-mechanical reliability i...
AbstractThis paper describes the evolution of the microstructure and conductivity of electroless cop...
Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different ...
DC magnetron sputter deposition of copper thin films is evaluated for resistivity, conformality etc....
Thins films are deposited on bulk materials to attain properties which are superior to the parent su...
Copper thin films have been deposited by sputtering. The simulation results show that most of depos...
Copper has become the metal of choice for metallization, owing to its high electrical and thermal co...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
Apart from the scientific interest, texture development in copper thin films is of crucial importanc...
Author name used in this publication: C. H. Woo2002-2003 > Academic research: refereed > Publication...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We ...
Thin copper films have various application in the electronic industry for the fabrication of contac...
We successfully fabricated the submicron Cu thin films with different texture components and thickne...
Texture in films develops during deposition processes and annealing of patterned wafers. Recent stud...
Copper interconnects in microelectronics have long been plagued with thermo-mechanical reliability i...
AbstractThis paper describes the evolution of the microstructure and conductivity of electroless cop...
Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different ...
DC magnetron sputter deposition of copper thin films is evaluated for resistivity, conformality etc....
Thins films are deposited on bulk materials to attain properties which are superior to the parent su...
Copper thin films have been deposited by sputtering. The simulation results show that most of depos...
Copper has become the metal of choice for metallization, owing to its high electrical and thermal co...
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