Author name used in this publication: J. Y. DaiAuthor name used in this publication: K. H. WongAuthor name used in this publication: H. L. W. ChanAuthor name used in this publication: C. L. Choy2002-2003 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Ultra-thin Ti and Er co-doped HfO2 films were grown on Si substrate by RF sputtering at different co...
Author name used in this publication: P. F. LeeAuthor name used in this publication: J. Y. Dai2006-2...
As the MOS devices continue to scale down in feature size, the gate oxide thickness is approaching t...
2002-2003 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
2003-2004 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Ultrathin amorphous films of Hf-aluminate (Hf-Al-O) have been deposited on p-type (100) Si substrate...
The rapidly evolving silicon industry demands devices with high-speed and low power consumption. Thi...
The progress of the silicon-based complementary-metal-oxide-semiconductor (CMOS) technology is mainl...
Thin film, high-k capacitors are processed via ALD (atomic layer deposition). At a temperature of 20...
Wang Lei.Thesis (M.Phil.)--Chinese University of Hong Kong, 2006.Includes bibliographical references...
textAs aggressive scaling of the Metal-Oxide-Semiconductor (MOS) integrated circuit continues, the ...
textThe continuous scaling of microelectronic devices requires high permittivity (high-k) dielectric...
A thin film structure of a HfSixOy/Al2O3/Si gate stack was fabricated on Si(100) by self-limiting at...
Atomic layer deposition (ALD) is potentially a very suitable deposition technology to grow ultra thi...
Hafnium-based high-x dielectric materials have been successfully used in the industry as a key repla...
Ultra-thin Ti and Er co-doped HfO2 films were grown on Si substrate by RF sputtering at different co...
Author name used in this publication: P. F. LeeAuthor name used in this publication: J. Y. Dai2006-2...
As the MOS devices continue to scale down in feature size, the gate oxide thickness is approaching t...
2002-2003 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
2003-2004 > Academic research: refereed > Publication in refereed journalVersion of RecordPublishe
Ultrathin amorphous films of Hf-aluminate (Hf-Al-O) have been deposited on p-type (100) Si substrate...
The rapidly evolving silicon industry demands devices with high-speed and low power consumption. Thi...
The progress of the silicon-based complementary-metal-oxide-semiconductor (CMOS) technology is mainl...
Thin film, high-k capacitors are processed via ALD (atomic layer deposition). At a temperature of 20...
Wang Lei.Thesis (M.Phil.)--Chinese University of Hong Kong, 2006.Includes bibliographical references...
textAs aggressive scaling of the Metal-Oxide-Semiconductor (MOS) integrated circuit continues, the ...
textThe continuous scaling of microelectronic devices requires high permittivity (high-k) dielectric...
A thin film structure of a HfSixOy/Al2O3/Si gate stack was fabricated on Si(100) by self-limiting at...
Atomic layer deposition (ALD) is potentially a very suitable deposition technology to grow ultra thi...
Hafnium-based high-x dielectric materials have been successfully used in the industry as a key repla...
Ultra-thin Ti and Er co-doped HfO2 films were grown on Si substrate by RF sputtering at different co...
Author name used in this publication: P. F. LeeAuthor name used in this publication: J. Y. Dai2006-2...
As the MOS devices continue to scale down in feature size, the gate oxide thickness is approaching t...