As well as most polymer materials, adhesives generally exhibit significant viscous behaviour over a wide temperature range. However, strain rate sensitivity, relaxation or creep phenomena are rarely explicitly considered when crack propagation phenomena along adhesively bonded joints are involved. In the present contribution, a detailed analysis of crack propagation along viscoelastic and elasto–viscoplastic interface in a double cantilever beam (DCB) test is proposed. The Nishihara Model is used for modelling the interface separation mechanical response. Assuming self-similar crack propagation regime, a Eulerian representation can be used to simplify the resolution of the constitutive equations which control the stress/strain distribution ...
Adhesive bonding consists in the joining of two adherents by an adhesive, typically made of glassy t...
The evolution in adhesive bonding technology is characterised by a continuously improving mechanical...
The present paper deals with the analytical investigation of the mode-I debonding occurring in the d...
International audienceDouble-Cantilever Beam (DCB) testing is a common protocol to evaluate bonded i...
Al~tract--The mechanics of fracture of a stably extending interface crack in polymeric adhesive bond...
AbstractAdhesive bonding technology is a promising alternative to traditional joining techniques. In...
An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich,...
International audienceThe motion of the triple line during the debonding of a soft viscoelastic adhe...
This thesis develops a numerical and experimental framework to model and characterise the rate-depen...
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformati...
Most of the adhesives used in the marine industry are polymers with a mechanical behaviour which is ...
The increasing use of adhesive joints in dynamic applications require reliable measurements of the r...
The cohesive zone model is used in the analysis of fracture of plastically-deforming adhesive joints...
The growth of a crack located at the interface between two linearly (visco)elastic solids is investi...
The prediction of the interfacial failure mechanisms for adhesively bonded joints and composite stru...
Adhesive bonding consists in the joining of two adherents by an adhesive, typically made of glassy t...
The evolution in adhesive bonding technology is characterised by a continuously improving mechanical...
The present paper deals with the analytical investigation of the mode-I debonding occurring in the d...
International audienceDouble-Cantilever Beam (DCB) testing is a common protocol to evaluate bonded i...
Al~tract--The mechanics of fracture of a stably extending interface crack in polymeric adhesive bond...
AbstractAdhesive bonding technology is a promising alternative to traditional joining techniques. In...
An important source of interface fracture contributing to adhesive failure in a bimaterial sandwich,...
International audienceThe motion of the triple line during the debonding of a soft viscoelastic adhe...
This thesis develops a numerical and experimental framework to model and characterise the rate-depen...
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformati...
Most of the adhesives used in the marine industry are polymers with a mechanical behaviour which is ...
The increasing use of adhesive joints in dynamic applications require reliable measurements of the r...
The cohesive zone model is used in the analysis of fracture of plastically-deforming adhesive joints...
The growth of a crack located at the interface between two linearly (visco)elastic solids is investi...
The prediction of the interfacial failure mechanisms for adhesively bonded joints and composite stru...
Adhesive bonding consists in the joining of two adherents by an adhesive, typically made of glassy t...
The evolution in adhesive bonding technology is characterised by a continuously improving mechanical...
The present paper deals with the analytical investigation of the mode-I debonding occurring in the d...