Copper and its alloys with steel, including stainless steel, are soldered using brazing materials CuAgZn and CuAg- ZnSn. They are used for making connections in heating, cooling and renewable energy sources (RES) devices. The elements used in the above-mentioned alloys affect wettability, castability, corrosion resistance, impact resistance, plasticity, stress resistance and also increase the melting point of the solder. The article presents the impact of the percentage of alloying additives covered by the EN ISO 17672 standard on performance and susceptibility to soldering brazing materials Ag44 and Ag40Sn
For several years, Sn-0.7Cu solder has been used in electronic packaging industries to replace the ...
Brazing is a 5000 year-old joining process. Components are joined by heating them above the liquidus...
This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, th...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contra...
The aim of this work was to study the effects of Ag and Cu on the thermal properties and microstruct...
This paper describes an investigation of cadmium-free silver brazing filler metals, the ternary Ag-C...
The article presents the results of research on the metallurgical synthesis of CuCrZr copper alloys ...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Low-Ag Sn-Ag-Cu (SAC) alloys such as Sn-1 wt.%Ag-0.5 wt.% Cu (SAC105) have been considered as a solu...
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
Solder joints based on eutectic SnZn alloy were studied. The influence of Ga and Ag was analysed and...
The individual sections, wiring and construction of electromagnet windings responsible for strong ma...
In this article, environmental friendly BAg25Cu40Zn34Sn (BAg-25) and BAg30Cu37Zn32Sn (BAg-30) flux-c...
The research involved vacuum tests of brazing properties of silver filler metals, containing tin as ...
For several years, Sn-0.7Cu solder has been used in electronic packaging industries to replace the ...
Brazing is a 5000 year-old joining process. Components are joined by heating them above the liquidus...
This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, th...
This article will present the influence of thermal aging and the reflow cycle numbers on intermetall...
The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contra...
The aim of this work was to study the effects of Ag and Cu on the thermal properties and microstruct...
This paper describes an investigation of cadmium-free silver brazing filler metals, the ternary Ag-C...
The article presents the results of research on the metallurgical synthesis of CuCrZr copper alloys ...
Detailed studies to characterize the microstructural development and mechanical properties of eutect...
Low-Ag Sn-Ag-Cu (SAC) alloys such as Sn-1 wt.%Ag-0.5 wt.% Cu (SAC105) have been considered as a solu...
Lead free solders are expected to replace the traditional Sn-Pb alloys due to environmental concern....
Solder joints based on eutectic SnZn alloy were studied. The influence of Ga and Ag was analysed and...
The individual sections, wiring and construction of electromagnet windings responsible for strong ma...
In this article, environmental friendly BAg25Cu40Zn34Sn (BAg-25) and BAg30Cu37Zn32Sn (BAg-30) flux-c...
The research involved vacuum tests of brazing properties of silver filler metals, containing tin as ...
For several years, Sn-0.7Cu solder has been used in electronic packaging industries to replace the ...
Brazing is a 5000 year-old joining process. Components are joined by heating them above the liquidus...
This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, th...