The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequent...
International audienceSilver plating processes have become key technologies for connector applicatio...
© 2015 Springer Science+Business Media New York Solid-state processes of bonding 1 mm copper (Cu) wi...
The purpose of this thesis was to develop the wire bonding process by changing the design of the cap...
This project deals with interconnection of semiconductor chips, especially interconnection using sil...
The combination of aluminum (Al) and silver (Ag) for wire bonding is long established: aluminum (Al)...
Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and...
Despite the superior physical properties of silver (Ag) and its alloys such as high electrical and t...
This critical volume provides an in-depth presentation of copper wire bonding technologies, processe...
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the ch...
Increasing I/O numbers and device complexity, higher clock frequencies, and the trend to product min...
Wire bonding is still the dominating technology for realizing the first level contact of semiconduct...
A major challenge in today’s high-temperature power electronics is the lack of reliable packaging ma...
Wire bonding technology is the earliest chip level interconnection technology, but it is still the m...
Wire bonding technology has been widely used in the semiconductor industry for interconnection betwe...
The substantial growth in the electronics industry has created a need for environmental and user-fri...
International audienceSilver plating processes have become key technologies for connector applicatio...
© 2015 Springer Science+Business Media New York Solid-state processes of bonding 1 mm copper (Cu) wi...
The purpose of this thesis was to develop the wire bonding process by changing the design of the cap...
This project deals with interconnection of semiconductor chips, especially interconnection using sil...
The combination of aluminum (Al) and silver (Ag) for wire bonding is long established: aluminum (Al)...
Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and...
Despite the superior physical properties of silver (Ag) and its alloys such as high electrical and t...
This critical volume provides an in-depth presentation of copper wire bonding technologies, processe...
Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the ch...
Increasing I/O numbers and device complexity, higher clock frequencies, and the trend to product min...
Wire bonding is still the dominating technology for realizing the first level contact of semiconduct...
A major challenge in today’s high-temperature power electronics is the lack of reliable packaging ma...
Wire bonding technology is the earliest chip level interconnection technology, but it is still the m...
Wire bonding technology has been widely used in the semiconductor industry for interconnection betwe...
The substantial growth in the electronics industry has created a need for environmental and user-fri...
International audienceSilver plating processes have become key technologies for connector applicatio...
© 2015 Springer Science+Business Media New York Solid-state processes of bonding 1 mm copper (Cu) wi...
The purpose of this thesis was to develop the wire bonding process by changing the design of the cap...