The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils. Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature. When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved. Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained. Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
In this paper a technological approach for the fabrication of deformable electronic surfaces is revi...
The emergence of wearable electronics is leading away from glass substrates for the display backplan...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
Novel large-area electronics, such as electronic paper, sensor skin, and electrotextiles, requires b...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
Flexible electronics will have inorganic devices grown at elevated temperatures on free-standing foi...
Much of the mechanical strain in semiconductor devices can be relieved when they are made on complia...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
In this paper a technological approach for the fabrication of deformable electronic surfaces is revi...
The emergence of wearable electronics is leading away from glass substrates for the display backplan...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
In this paper, the mechanics of rolling and deforming thin foil substrates in two and three dimensio...
Novel large-area electronics, such as electronic paper, sensor skin, and electrotextiles, requires b...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
Flexible electronics will have inorganic devices grown at elevated temperatures on free-standing foi...
Much of the mechanical strain in semiconductor devices can be relieved when they are made on complia...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
When devices are fabricated on thin foil substrates, any mismatch strain in the device structure mak...
In this paper a technological approach for the fabrication of deformable electronic surfaces is revi...