The influence of heat treatment and finishing on the mechanical properties of laminar composites

The aim of this investigation was to define the optimum conditions of obtaining glass fabric - epoxy resin laminar composites with appropriate mechanical properties that satisfy the quality needed for production of printed circuit boards for microelectronics. Commercial materials: domestic glass woven fabric, different types of silane finish and epoxy resin were starting materials in obtaining composites. The conditions needed for the thermal removal of the original size from glass fabric were investigated. The optimal heat treatment should be performed on temperatures less than 550C, while cooling rate should be as slow as possible. In this manner the fabric has less than 0.1% of residual size, and the mechanical properties remain satisfactory. Two most commonly used silane based finishes were applied on heat-treated glass fabric. Tensile strength of the composite material made of thermally and chemically treated glass fabric and epoxy resin was investigated. The possibility of using domestic glass fabric in production of printed circuit boards for microelectronics has been confirmed. Finish with amino functional group and lower heat treatment temperature should be used for obtaining glass-fabric epoxy resin laminar composites with desirable mechanical properties