The thin films are used in a large number of industrial fields such as Micro- and Nano- Technology (MNT) or treatment of surfaces. They can be used either as layer structures, or to provide protection functions or functionalized surfaces. There are generally two types of thin layers deposited thin films and self-supporting thin layers. The objective of the work presented in this manuscript is to develop methods for mechanical characterization of elastic-plastic behavior of free-standing thin films and deposited. First, we present a microtensile test able to work on 750 nm thick layers and associated technical means. These tools allow to characterize the elastic-plastic properties and mechanical damage freestanding thin films. In a second st...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Determination of mechanical properties of very thin films is rather difficult task as all of current...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Les couches minces sont utilisées dans un nombre important de domaines industriels comme les Micro- ...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
The European Space Agency and CNES are studying the possibility of sending microsystems in space, es...
One of the major topics in novel microelectronics are thin film materials - especially their mechani...
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of micr...
The present work summarizes the novel experimental methods recently developed to characterize the me...
The paper compares two different methods for testing of metallic thin films: microcompression test a...
Abstract Mechanical properties of an aluminium thin film were measured by microcompression and inden...
The aim of the study is the determination of the mechanical properties of thin films by optical metr...
A novel experimental/numerical test method has been developed which allows accurate characterization...
The aim of this thesis is to develop and optimize a bench test for mechanical characterization of th...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Determination of mechanical properties of very thin films is rather difficult task as all of current...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Les couches minces sont utilisées dans un nombre important de domaines industriels comme les Micro- ...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
The European Space Agency and CNES are studying the possibility of sending microsystems in space, es...
One of the major topics in novel microelectronics are thin film materials - especially their mechani...
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of micr...
The present work summarizes the novel experimental methods recently developed to characterize the me...
The paper compares two different methods for testing of metallic thin films: microcompression test a...
Abstract Mechanical properties of an aluminium thin film were measured by microcompression and inden...
The aim of the study is the determination of the mechanical properties of thin films by optical metr...
A novel experimental/numerical test method has been developed which allows accurate characterization...
The aim of this thesis is to develop and optimize a bench test for mechanical characterization of th...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Determination of mechanical properties of very thin films is rather difficult task as all of current...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...