The novel conditioner was developed for uniform conditioning across a pad. The conditioner is composed by bendable fibers. Therefore, each abrasive conforms independently to the pad surface, differently from the traditional conditioner of plate type. The removal rate using the developed conditioner is equal to that using the traditional conditioner. However, the cut rate of pad using the developed one is tenth part of the cut rate using traditional one. Therefore, it was demonstrated that the developed conditioner realized more efficient conditioning. In addition, in order to evaluate the conditioning non-uniformity effectively, novel uniformity evaluation method was developed. The principle uses color variation by abrading the pad dyed on ...
Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global ...
Characterization of CMP pad conditioners using the latest achievements of tribo-metrology is importa...
Anew fixed abrasive-type Polishing Pad for CMP of semiconductor device oxide layer like as lLD and S...
The various pad surface treatments were evaluated to clarify dominant factors on a pad surface to ge...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
[[abstract]]The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and...
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non...
High precision optical components are required for modern life and future. To achieve component’s su...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
Abstract. Statistical models are presented to describe the evolution of the surface roughness of pol...
This dissertation consists of four topics that focused on investigating the fundamental characterist...
As the basic research for the Pad conditioning by the Diamond Conditioner, relationship between the ...
There are many elements affecting CMP performance such as slurry, pad, process parameters and pad c...
an im behav del d, and a er sub r CM impr 751 # A eived Conditioning schemes may be classified accor...
Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topogr...
Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global ...
Characterization of CMP pad conditioners using the latest achievements of tribo-metrology is importa...
Anew fixed abrasive-type Polishing Pad for CMP of semiconductor device oxide layer like as lLD and S...
The various pad surface treatments were evaluated to clarify dominant factors on a pad surface to ge...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
[[abstract]]The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and...
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non...
High precision optical components are required for modern life and future. To achieve component’s su...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
Abstract. Statistical models are presented to describe the evolution of the surface roughness of pol...
This dissertation consists of four topics that focused on investigating the fundamental characterist...
As the basic research for the Pad conditioning by the Diamond Conditioner, relationship between the ...
There are many elements affecting CMP performance such as slurry, pad, process parameters and pad c...
an im behav del d, and a er sub r CM impr 751 # A eived Conditioning schemes may be classified accor...
Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topogr...
Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global ...
Characterization of CMP pad conditioners using the latest achievements of tribo-metrology is importa...
Anew fixed abrasive-type Polishing Pad for CMP of semiconductor device oxide layer like as lLD and S...