This paper reports on the development of an RF IV waveform based stress test procedure. DC and low-voltage RF characterisation was carried out before and after high power RF stress. RF waveform measurements showed that the exact change in the RF load line induced during RF degradation cannot be directly inferred from the DC or low power RF measurement. The RF degradation takes the form of a knee-walkout, a small pinch-off shift consistent with charge trapping and defect generation, and in addition gate leakage occurs once the RF voltage exceeds a critical voltage
This paper presents the initial results in a study aimed at exploring the use of GaN-devices in appl...
Solid state amplifiers are often fitted with an isolator component on the output to protect them fr...
This work is aimed at investigating the performance and reliability limits of a commercially availab...
This paper reports on the development of an RF IV waveform based stress test procedure. DC and low-v...
An RF waveform stress test has been developed in order to assess device degradation caused by the in...
This paper employs, for the first time, RF waveform engineering to monitor device degradation over a...
This thesis looks at how the Radio Frequency (RF) waveform measurement and engineering techniques d...
The reliability of GaN HEMTs under RF stress has been evaluated and correlated with DC stress and cu...
The reliability of GaN HEMTs under RF stress has been evaluated and correlated with DC stress and cu...
International audienceIII-V wide bandgap disruptive technology is firmly positioned as a leader for ...
International audienceIII-V wide bandgap disruptive technology is positioned as a leader for high po...
An analysis of the reliability of GaN high-electron-mobility transistors during dc and RF stress tes...
International audienceSiGe and GaN technologies have achieved rapid development over the last two de...
The degradation of packaged GaN HEMTs for high power applications has been studied under long term r...
International audienceThe rapid development of III-V technologies for telecommunication and radar ma...
This paper presents the initial results in a study aimed at exploring the use of GaN-devices in appl...
Solid state amplifiers are often fitted with an isolator component on the output to protect them fr...
This work is aimed at investigating the performance and reliability limits of a commercially availab...
This paper reports on the development of an RF IV waveform based stress test procedure. DC and low-v...
An RF waveform stress test has been developed in order to assess device degradation caused by the in...
This paper employs, for the first time, RF waveform engineering to monitor device degradation over a...
This thesis looks at how the Radio Frequency (RF) waveform measurement and engineering techniques d...
The reliability of GaN HEMTs under RF stress has been evaluated and correlated with DC stress and cu...
The reliability of GaN HEMTs under RF stress has been evaluated and correlated with DC stress and cu...
International audienceIII-V wide bandgap disruptive technology is firmly positioned as a leader for ...
International audienceIII-V wide bandgap disruptive technology is positioned as a leader for high po...
An analysis of the reliability of GaN high-electron-mobility transistors during dc and RF stress tes...
International audienceSiGe and GaN technologies have achieved rapid development over the last two de...
The degradation of packaged GaN HEMTs for high power applications has been studied under long term r...
International audienceThe rapid development of III-V technologies for telecommunication and radar ma...
This paper presents the initial results in a study aimed at exploring the use of GaN-devices in appl...
Solid state amplifiers are often fitted with an isolator component on the output to protect them fr...
This work is aimed at investigating the performance and reliability limits of a commercially availab...