Effect of the Silver Nanoparticles in the Conductive Paste with the Spherical Silver Powder And Its Application to Flexible Substrates

Silver nanoparticles produced with a solid-phase thermal decomposition method were used for the preparation of a conductive paste supporting curing at low temperature. The conducting paste was prepared by blending fine spherical silver powder and silver nanoparticles with a diameter of 20nm in order to reduce the electric resistiviy of the electrodes. Although the viscosity of the conducting paste increased by about 25% after 60 days, it exhibited superior stability to dispersion in comparison to commercial paste. The electric resistivity of the electrode was of the order of 10^<-6>Ωcm at a curing temperature of 200℃. Using this conducting paste, it is possible to print at widths of 20μm. The resistivity was further reduced by 1 % in the high temperature test at 120℃, by 5% in the high humidity and high temperature test, and by 5% during the thermal shock test at temperatures ranging from-45 to 80℃