Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of each other while connected with a high-bandwidth and high-speed interconnect. In particular, die-stacking can be useful in boosting the effective bandwidth and speed of DRAM systems. Die-stacked DRAM caches have recently emerged as one of the top applications of die-stacking. They provide higher capacity than their SRAM counterparts and are faster than offchip DRAMs. In addition, DRAM caches can provide almost eight times the bandwidth of off-chip DRAMs. They, however, come with their own challenges. Since they are only twice as fast as main memory, they considerably increase latency for misses and incur significant energy overhead for remote l...
IEEE Due to the large storage capacity, high bandwidth and low latency, 3D DRAM is proposed to be th...
© 2017 Association for Computing Machinery. Placing the DRAM in the same package as a processor enab...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
Multiple-channel die-stacked DRAMs have been used for maximizing the performance and minimizing the ...
Die stacking memory technology can enable gigascale DRAM caches that can operate at 4x-8x higher ban...
Abstract—Recent research advocates large die-stacked DRAM caches in manycore servers to break the me...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
This paper presents an operating system managed die-stacked DRAM called i-MIRROR that mirrors high l...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Integrated circuits have been in constant progression since the first prototype in 1958, with the se...
DRAM memory systems require periodic recharging to avoid loss of data from leaky capacitors. These r...
Recent research advocates large die-stacked DRAM caches in manycore servers to break the memory late...
Abstract—This paper analyzes the trade-offs in architecting stacked DRAM either as part of main memo...
PosterDRAM vendors have traditionally optimized for low cost and high performance, often making desi...
IEEE Due to the large storage capacity, high bandwidth and low latency, 3D DRAM is proposed to be th...
© 2017 Association for Computing Machinery. Placing the DRAM in the same package as a processor enab...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...
Multiple-channel die-stacked DRAMs have been used for maximizing the performance and minimizing the ...
Die stacking memory technology can enable gigascale DRAM caches that can operate at 4x-8x higher ban...
Abstract—Recent research advocates large die-stacked DRAM caches in manycore servers to break the me...
the tight integration of significant quantities of DRAM with high-performance computation logic. How...
This paper presents an operating system managed die-stacked DRAM called i-MIRROR that mirrors high l...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Integrated circuits have been in constant progression since the first prototype in 1958, with the se...
DRAM memory systems require periodic recharging to avoid loss of data from leaky capacitors. These r...
Recent research advocates large die-stacked DRAM caches in manycore servers to break the memory late...
Abstract—This paper analyzes the trade-offs in architecting stacked DRAM either as part of main memo...
PosterDRAM vendors have traditionally optimized for low cost and high performance, often making desi...
IEEE Due to the large storage capacity, high bandwidth and low latency, 3D DRAM is proposed to be th...
© 2017 Association for Computing Machinery. Placing the DRAM in the same package as a processor enab...
As device technologies scale in the nanometer era, the current off-chip DRAM technologies are very c...