DATA AVAILABILITY : Data will be made available on request.In this paper, brushing technique was used to coat carbon nanotubes (CNT) on 6063 aluminium alloy in order to investigate the heat transfer performance for Light Emitting Diode (LED) application. The two different thickness such as 0.5 mm and 1 mm coating of CNT was applied an aluminium plate. Performance parameters, like LED case and junction temperatures and heat sink thermal resistance were studied. The results showed that the LED case temperature for 0.5 mm thick CNT coated heat sink decreased by 16.25 % when compared to alumimum plate at 400 mA. For the 400 mA, the 0.5 mm CNT coated heat sink has junction temperature 89 °C while the junction temperature of 1 mm CNT coated heat ...
This study performed a steady-state numerical analysis to understand the temperature in different he...
This study investigated the heat transfer characteristics of LED heat sink and the development proce...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...
Microelectronic packages and high brightness light emitting diode (HB-LED) packages face a common th...
Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substr...
In the point of efficient heat removal from light emitting diode (LED) package to ambient, the surfa...
This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of...
Metal coating of 3D printed polymers is an attractive proposition for thermal dissipation of light e...
The authors offer a new design in support of efficient heat dissipation for light emitting diodes (L...
The aim of this paper is to ensure proper thermal management in order to remove and dissipate the he...
Graphene heat-dissipating coating (GNHC) of 0.6 wt % GN concentration is utilized to promote the coo...
Light Emitting Diode (LED) applications are increasingly used in various microelectronic devices due...
This study optimizes the thermal dissipation ability of aluminum nitride (AlN) ceramics to increase ...
The major causes of electronic failure are four major factors cause contribute to the failure rate o...
With the increasing application of high power LEDs in general lighting, more effective cooling solut...
This study performed a steady-state numerical analysis to understand the temperature in different he...
This study investigated the heat transfer characteristics of LED heat sink and the development proce...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...
Microelectronic packages and high brightness light emitting diode (HB-LED) packages face a common th...
Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substr...
In the point of efficient heat removal from light emitting diode (LED) package to ambient, the surfa...
This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of...
Metal coating of 3D printed polymers is an attractive proposition for thermal dissipation of light e...
The authors offer a new design in support of efficient heat dissipation for light emitting diodes (L...
The aim of this paper is to ensure proper thermal management in order to remove and dissipate the he...
Graphene heat-dissipating coating (GNHC) of 0.6 wt % GN concentration is utilized to promote the coo...
Light Emitting Diode (LED) applications are increasingly used in various microelectronic devices due...
This study optimizes the thermal dissipation ability of aluminum nitride (AlN) ceramics to increase ...
The major causes of electronic failure are four major factors cause contribute to the failure rate o...
With the increasing application of high power LEDs in general lighting, more effective cooling solut...
This study performed a steady-state numerical analysis to understand the temperature in different he...
This study investigated the heat transfer characteristics of LED heat sink and the development proce...
Copyright © 2013 Bui HungThang et al.This is an open access article distributed under theCreativeCom...