We represent the results of a study on as the chelators used in the environmentally friendly electroless deposition bath changed depending on the amounts of hydroxides were present. The baths were prepared using polyhydroxides, glycerol and sorbitol, as chelators with copper methanesulfonate as the metal ion. Dimethylamine borane (DMAB) was used as the reducing agent with methylthiourea and cytosine, as additives in both the glycerol and sorbitol contained baths. Potassium hydroxide was used as the pH adjuster, with glycerol and sorbitol baths maintained at a pH of 11.50 and 10.75 respectively at a room temperature of 28 ± 2 °C. XRD, SEM, AFM, cyclic voltammetry studies, Tafel and Impedance studies, as well as additional methods, were emplo...
Electrochemical deposition of metals on metals is a widely used industrial process and understanding...
The effects of cobalt additive on the positive electrode surface of nickel alkaline batteries are in...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...
Department of Chemistry, Pachaiyappa’s College, Chennai-600 030, India E-mail: jlakshmi2007@gmail.c...
R and D, Bharathiar University, Coimbatore-641 046, Tamilnadu, India RMK College of Engineering and...
Electroless deposition of Cu was investigated on thin Co layer for through Si via with high aspect r...
R&D, Bharathiar University, Coimbatore-641 046, Tamil Nadu, India RMK College of Engineering and Te...
This thesis describes the work of my Ph.D studies in Industrial Engineering during past three years....
Electroless copper films were prepared from an EDTA bath in which pH was adjusted with three kinds o...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrat...
Copper deposition from solutions using high concentration of acid, metal ions and polyethylene glyco...
Electrodeposited copper serves as a preplate before deposition of nickel, silver or gold. It is also...
Electroless copper deposition is widely used for printed circuit applications. A new bath based on ...
Copper strike baths are extensively used in metal plating industry as they present the ability to pl...
Electrochemical deposition of metals on metals is a widely used industrial process and understanding...
The effects of cobalt additive on the positive electrode surface of nickel alkaline batteries are in...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...
Department of Chemistry, Pachaiyappa’s College, Chennai-600 030, India E-mail: jlakshmi2007@gmail.c...
R and D, Bharathiar University, Coimbatore-641 046, Tamilnadu, India RMK College of Engineering and...
Electroless deposition of Cu was investigated on thin Co layer for through Si via with high aspect r...
R&D, Bharathiar University, Coimbatore-641 046, Tamil Nadu, India RMK College of Engineering and Te...
This thesis describes the work of my Ph.D studies in Industrial Engineering during past three years....
Electroless copper films were prepared from an EDTA bath in which pH was adjusted with three kinds o...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
Ammonia borane (AB) has been used as a reducing agent in the deposition of cobalt on copper substrat...
Copper deposition from solutions using high concentration of acid, metal ions and polyethylene glyco...
Electrodeposited copper serves as a preplate before deposition of nickel, silver or gold. It is also...
Electroless copper deposition is widely used for printed circuit applications. A new bath based on ...
Copper strike baths are extensively used in metal plating industry as they present the ability to pl...
Electrochemical deposition of metals on metals is a widely used industrial process and understanding...
The effects of cobalt additive on the positive electrode surface of nickel alkaline batteries are in...
To meet the requirement of PCB copper interconnection, a low temperature and low stress electroless ...