International audienceSynergy effect of total ionizing dose (TID) on alpha-soft error rate (a-SER) in FDSOI 28nm SRAM has been experimentally characterized using a dedicated setup combining alpha-particle irradiation (241 Am solid source) in vacuum chamber and 10 keV X-ray irradiation. Measurements have been performed on a 3 Mbit single-port SRAM cut powered at 1V. Irradiations up to 125 krad(Si) have been achieved and their impact on the alpha-SER has been characterized from the cumulated number of bitflips as a function of the exposition time to the alpha-source. Modelling and simulation have been used to link transistor threshold voltage variations to SRAM cell stability in terms of static noise margin (SNM), critical charge (Qcrit) and ...
This article reviews state-of-the-art techniques for the evaluation of the effect of radiation on st...
A simulation tool for calculating the soft error rate due to a-particle strikes in SRAM's is de...
Single-event upset (SEU) hardness varies across dies, wafers, and lots—even just after fabrication a...
Conference on Radiation Effects on Components and Systems (RADECS)/Radiation Effects Data Workshop, ...
The contribution of alpha particles to soft error rate is quite significant, especially in planar CM...
2010 Conference on Radiation and its Effects on Components and Systems (RADECS), Langenfeld, GERMANY...
Soft errors induced by radiation are the major reliability threat for SRAM-based field-programmable ...
The total ionizing dose (TID) effects on single-event upset (SEU) hardness are investigated for two ...
The static random access memory (SRAM) of an ultralow power system-on-chip (SoC) was tested for sing...
The power consumption of Static Random Access Memory (SRAM) has become an important issue for modern...
Abstract—This paper discusses soft error immunity of sub-threshold SRAM presenting neutron- and alph...
21st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF)...
28th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF)...
International audienceAltitude and underground real-time soft error rate (SER) measurements on SRAM ...
To evaluate a device sensitivity against alpha particles, traditional Single Event Effect (SEE) test...
This article reviews state-of-the-art techniques for the evaluation of the effect of radiation on st...
A simulation tool for calculating the soft error rate due to a-particle strikes in SRAM's is de...
Single-event upset (SEU) hardness varies across dies, wafers, and lots—even just after fabrication a...
Conference on Radiation Effects on Components and Systems (RADECS)/Radiation Effects Data Workshop, ...
The contribution of alpha particles to soft error rate is quite significant, especially in planar CM...
2010 Conference on Radiation and its Effects on Components and Systems (RADECS), Langenfeld, GERMANY...
Soft errors induced by radiation are the major reliability threat for SRAM-based field-programmable ...
The total ionizing dose (TID) effects on single-event upset (SEU) hardness are investigated for two ...
The static random access memory (SRAM) of an ultralow power system-on-chip (SoC) was tested for sing...
The power consumption of Static Random Access Memory (SRAM) has become an important issue for modern...
Abstract—This paper discusses soft error immunity of sub-threshold SRAM presenting neutron- and alph...
21st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF)...
28th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF)...
International audienceAltitude and underground real-time soft error rate (SER) measurements on SRAM ...
To evaluate a device sensitivity against alpha particles, traditional Single Event Effect (SEE) test...
This article reviews state-of-the-art techniques for the evaluation of the effect of radiation on st...
A simulation tool for calculating the soft error rate due to a-particle strikes in SRAM's is de...
Single-event upset (SEU) hardness varies across dies, wafers, and lots—even just after fabrication a...