The shrinking of technology nodes has led to high density memories containing large amounts of transistors which are prone to defects and reliability issues. Their test is generally based on the use of well-known March algorithms targeting Functional Fault Models (FFMs). This paper presents a novel approach for memory testing which relies on Cell-Aware (CA) methodology to further improve the yield of System on Chips (SoCs). Consequently, using CA methodology converts memory testing from functional to structural testing. In this work, the preliminary flow of the CA-based memory testing methodology is presented. The generation of the CA model for the SRAM bit cell has been demonstrated as a case study. The generated CA model and the structura...
SRAM cell stability has become an important design and test issue owing to significant process sprea...
Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly re...
Abstract—With increasing inter-die and intra-die parameter variations in sub-100-nm process technolo...
National audienceThis paper presents a novel approach to memory testing which relies on Cell-Aware (...
Cell-aware test (CAT) explicitly targets faults caused by defects inside library cells to improve te...
International audienceAs the semiconductor industry continues to shrink the transistor feature size,...
Embedded SRAM bit count is constantly growing limiting yield in systems-on-chip (SoCs). As technolog...
Due to their large number of high-precision, defect-prone manufacturing steps, integrated circuits (...
Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly re...
Recently, the adoption of Cell-Aware Testing (CAT) has become an option for an increasing number of ...
International audienceIn today's electronic designs, more and more memories are embedded in a single...
Abstract—Core-cell stability represents the ability of the core-cell to keep the stored data. With t...
Reliable cell stability test of modern embedded SRAMs calls for DFT techniques with a flexible detec...
SRAM cell stability has become an important design and test issue owing to significant process sprea...
Testing embedded memories in a chip can be very challenging due to their high-density nature and man...
SRAM cell stability has become an important design and test issue owing to significant process sprea...
Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly re...
Abstract—With increasing inter-die and intra-die parameter variations in sub-100-nm process technolo...
National audienceThis paper presents a novel approach to memory testing which relies on Cell-Aware (...
Cell-aware test (CAT) explicitly targets faults caused by defects inside library cells to improve te...
International audienceAs the semiconductor industry continues to shrink the transistor feature size,...
Embedded SRAM bit count is constantly growing limiting yield in systems-on-chip (SoCs). As technolog...
Due to their large number of high-precision, defect-prone manufacturing steps, integrated circuits (...
Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly re...
Recently, the adoption of Cell-Aware Testing (CAT) has become an option for an increasing number of ...
International audienceIn today's electronic designs, more and more memories are embedded in a single...
Abstract—Core-cell stability represents the ability of the core-cell to keep the stored data. With t...
Reliable cell stability test of modern embedded SRAMs calls for DFT techniques with a flexible detec...
SRAM cell stability has become an important design and test issue owing to significant process sprea...
Testing embedded memories in a chip can be very challenging due to their high-density nature and man...
SRAM cell stability has become an important design and test issue owing to significant process sprea...
Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly re...
Abstract—With increasing inter-die and intra-die parameter variations in sub-100-nm process technolo...