Displacement measurement was conducted on compact normal and shear specimens made of acrylic homogeneous material subjected to mixed-mode loading by digital image correlation. The intelligent hybrid method proposed by Nishioka et al. was applied to the stress-strain analysis near the crack tip. The accuracy of stress-intensity factor at the free surface was discussed from the viewpoint of both the experiment and 3-D finite element analysis. The surface images before and after deformation were taken by a CMOS camera, and we developed the system which enabled the real time stress analysis based on digital image correlation and inverse problem analysis. The great portion of processing time of this system was spent on displacement analysis. The...
Atomic Force Microscopy images of a crack intersecting the free surface of a glass specimen are take...
The deformation and strain measurements have always been one of the main issues in structural engine...
In order to achieve realistic simulations of the chip formation, high quality input data regarding t...
International audienceDigital image correlation is a measurement technique that allows one to retrie...
AbstractThis paper developed a least-squares method to evaluate the mixed-mode stress intensity fact...
P Lopez-Crespo, A. Garcia-Gonzalez, Experimental evaluation of Stress Intensity Factors from strain ...
In the present work, an experimental study is carried out to estimate the mixed-mode stress intensit...
Stress intensity factors are obtained from displacement-prescribed boundary conditions on a subregio...
The fracture analysis of cracks in a structure under complex loading is an important topic to study ...
A novel hybrid image processing method is proposed to obtain the crack tip location, crack propagati...
The mode I fracture parameters for an orthotropic body are directly calculated from full-field defor...
International audienceDigital image correlation (DIC) is more and more popular to monitor fatigue cr...
This paper addresses the development of image-based procedures for determination of displacement and...
The digital image correlation (DIC) technique is used to calculate the coefficients of higher order ...
The effect of these parameters on the SIF evaluation are then tested for stable and accurate SIF est...
Atomic Force Microscopy images of a crack intersecting the free surface of a glass specimen are take...
The deformation and strain measurements have always been one of the main issues in structural engine...
In order to achieve realistic simulations of the chip formation, high quality input data regarding t...
International audienceDigital image correlation is a measurement technique that allows one to retrie...
AbstractThis paper developed a least-squares method to evaluate the mixed-mode stress intensity fact...
P Lopez-Crespo, A. Garcia-Gonzalez, Experimental evaluation of Stress Intensity Factors from strain ...
In the present work, an experimental study is carried out to estimate the mixed-mode stress intensit...
Stress intensity factors are obtained from displacement-prescribed boundary conditions on a subregio...
The fracture analysis of cracks in a structure under complex loading is an important topic to study ...
A novel hybrid image processing method is proposed to obtain the crack tip location, crack propagati...
The mode I fracture parameters for an orthotropic body are directly calculated from full-field defor...
International audienceDigital image correlation (DIC) is more and more popular to monitor fatigue cr...
This paper addresses the development of image-based procedures for determination of displacement and...
The digital image correlation (DIC) technique is used to calculate the coefficients of higher order ...
The effect of these parameters on the SIF evaluation are then tested for stable and accurate SIF est...
Atomic Force Microscopy images of a crack intersecting the free surface of a glass specimen are take...
The deformation and strain measurements have always been one of the main issues in structural engine...
In order to achieve realistic simulations of the chip formation, high quality input data regarding t...