Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circuits and, under some conditions, vacuum metal arcs capable of sustaining hundreds of amps. Typical whiskers are 3-4 mu m in diameter and approach 2 mm in length; they are strong enough to penetrate one layer of conformal coating. The physical and electrical properties of tin whiskers and the reasons for their growth are discussed. A methodology to disposition to use of tin in existing spacecraft hardware is presented. It permits the use of tin when growth conditions are strongly adverse or when the tin-plated components are conformally coated. In cases where whisker growth is considered possible and problematic, removal and replacement, or car...
Purpose: This paper presents the results of a 32 year old laboratory study of whisker growth from ti...
Electroplated tin finishes are widely used in the electronics industry due to their excellent solder...
The effect of electroplating parameters and substrate material on tin whisker formation This item wa...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent ...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
The global trend to eliminate lead from electronic devices is driven by legislative and marketing pr...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
The effect of various thicknesses of tin coating towards tin whiskers formation and growth in 30°C/6...
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replac...
Purpose: This paper presents the results of a 32 year old laboratory study of whisker growth from ti...
Electroplated tin finishes are widely used in the electronics industry due to their excellent solder...
The effect of electroplating parameters and substrate material on tin whisker formation This item wa...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which i...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Since the use of the most stable Pb-based materials in the electronic industry has been banned due t...
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent ...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
The global trend to eliminate lead from electronic devices is driven by legislative and marketing pr...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
The effect of various thicknesses of tin coating towards tin whiskers formation and growth in 30°C/6...
The ban on lead in electronic industry caused manufacturers to search for alternative ways to replac...
Purpose: This paper presents the results of a 32 year old laboratory study of whisker growth from ti...
Electroplated tin finishes are widely used in the electronics industry due to their excellent solder...
The effect of electroplating parameters and substrate material on tin whisker formation This item wa...