Electronic and photonic IC co-design for high-speed optical transceivers

New circuit architectures and technologies for high-speed electronic and photonic integrated circuits are essential to realize optical interconnects with higher symbol rate. As a consequence of the increasing speeds, close integration and co-design of photonic and electronic chips have become a necessity to realize high-performance transceivers with novel packaging approaches. This presentation will illustrate a number of recent developments of application-specific high-speed electro-optic transceiver circuits including e.g. broadband driver amplifiers, multiplexer circuits and transimpedance amplifiers for signal generation and reception at 100 Gbaud and beyond