Wafer Saw Defects Mitigation through Laser Grooving Technology

The paper presented a technical study on laser (light amplification by stimulated emission of radiation) grooving as breakthrough and vital solution in wafer saw process. The technical paper is intended to address various defects such as chippings, metal dangling and peel off, cracks, and other wafer-related defects induced during wafer saw process. Series of process simulations, actual processing, benchmarking, and collaborations with suppliers are carried out to attain a zero defect in wafer sawing. Critical processes and controls on this new technology are shown and how the mentioned defects are properly addressed. Sawing process is considered as one of the challenges in the plant as it deals with different wafer technologies. Different blade types also need to be properly maintained. Compared to the conventional and universal mechanical sawing using blades, with laser grooving technology complex errors and top reject contributor of identified critical processes are corrected and required process capability index is achieved