Outline Introduction: Yield, performance and reliability of 4H-SiC power devices Influences on yield/performance of 4H-SiC power devices Process variations: A example (lithography) Extended epitaxial defects An overview Stacking faults - Dark triangle defects Stacking faults - Light triangle defects Surface pits in implanted areas Influence of epitaxial defects on gate oxide performance Conclusio
A comprehensive study of displacement damage and total ionisation dose effects on 4H-silicon carbide...
4H-SiC PiN diodes for 6.5 kV were manufactured on both 4° and 8° off-cut substrates and subjected to...
It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly s...
The current status of SiC bulk growth is reviewed, while specific attention is given to the effect ...
Although dramatic improvements have been made in the performance of unipolar 4H-SiC power devices, c...
Using a combination of photoluminescence and electrical characterization, defects in the epitaxial l...
Silicon carbide is a semiconductor of choice for the fabrication of high-power, high-temperature and...
In this paper the results of a study in which the surface quality of 30, 35 and 110 µm 4H-SiC epitax...
Reports on the characteristics of a major defect in mass-produced silicon carbide wafers which sever...
Commercial epilayers are known to contain a variety of crystallographic imperfections. including mic...
Basal Plane Dislocations (BPD) in SiC are thought to cause degradation of bipolar devices as they ca...
Expansion and contraction of Shockley type stacking faults (SF) due to the glide of basal plane disl...
In-house developed (1–100) and (11–20) oriented 4H-SiC wafers, and a reference wafer were used to ev...
We report on the defect influence on the electrical properties of 4H-SiC Schottky diodes. The device...
The Fraunhofer IISB will introduce its activities in Silicon Carbide to the spintronic community wit...
A comprehensive study of displacement damage and total ionisation dose effects on 4H-silicon carbide...
4H-SiC PiN diodes for 6.5 kV were manufactured on both 4° and 8° off-cut substrates and subjected to...
It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly s...
The current status of SiC bulk growth is reviewed, while specific attention is given to the effect ...
Although dramatic improvements have been made in the performance of unipolar 4H-SiC power devices, c...
Using a combination of photoluminescence and electrical characterization, defects in the epitaxial l...
Silicon carbide is a semiconductor of choice for the fabrication of high-power, high-temperature and...
In this paper the results of a study in which the surface quality of 30, 35 and 110 µm 4H-SiC epitax...
Reports on the characteristics of a major defect in mass-produced silicon carbide wafers which sever...
Commercial epilayers are known to contain a variety of crystallographic imperfections. including mic...
Basal Plane Dislocations (BPD) in SiC are thought to cause degradation of bipolar devices as they ca...
Expansion and contraction of Shockley type stacking faults (SF) due to the glide of basal plane disl...
In-house developed (1–100) and (11–20) oriented 4H-SiC wafers, and a reference wafer were used to ev...
We report on the defect influence on the electrical properties of 4H-SiC Schottky diodes. The device...
The Fraunhofer IISB will introduce its activities in Silicon Carbide to the spintronic community wit...
A comprehensive study of displacement damage and total ionisation dose effects on 4H-silicon carbide...
4H-SiC PiN diodes for 6.5 kV were manufactured on both 4° and 8° off-cut substrates and subjected to...
It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly s...