Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post- CMOS Applications 11

The papers included in this issue of ECS Transactions were originally presented during the 11th international symposium on “Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications.” The symposium was held as part of the 239th ECS Meeting with the 18th International Meeting on Chemical Sensors (IMCS), from May 30-June 3, 2021. The meeting was originally planned for Chicago, Illinois, and was moved to a digital platform due to the ongoing COVID-19 pandemic. In line with the transforming technological landscape, this year’s symposium continues to focus on novel materials, advanced devices, and critical FEOL and BEOL technologies to enable advanced integrated circuits. The symposium featured beyond CMOS technology focusing on nonvolatile memory/switching elements, such as phase change and ferroelectrics for neuromorphic computing, machine/artificial intelligence, and quantum computing. Topics on heterogeneous and 3D integration for advanced packaging enabling 3D stackings of chips with different functionality were also featured during this year’s symposium. The organizers would like to express their gratitude to the ECS staff, all speakers, invited and contributing, for their interest in this symposium, and for submitting high-quality abstracts and preparing their manuscripts. The organizers would also like express their gratitude to the digital meeting attendees, and the entire community overall for their support, resilience, and commitment to the Society. Finally, the success of the symposium is greatly and positively influenced by the financial support given by the sponsoring ECS divisions, Electronics and Photonics (lead sponsor) and Dielectric Science & Technology, as well as our industrial sponsors Yield Engineering Systems, Inc. (YES) and Mattson Technology, Inc.. Their loyal support and sponsorship are highly appreciated. The strong interest and participation seen this year is a testament to your dedication and efforts to help advance technology for solving the challenges of the present and future