The plasma of a CF4-quartz etching system is investigated with optical methods. The presence of CF2, CF, F, and CO is demonstrated from ultraviolet and visible emission. Using infrared absorption the absolute densities of the reaction products SiF4and CO are found to be 2.5 ± 0.4 X 1020and3 ± 2x 1020m-3. CF2 radicals are not found with infrared absorption which means that their density is below 1019m-3. The results indicate that quartz is etched through the reaction Si02 + 2CF2—â–º SiF4+ 2CO.</p
The reactive ion etching of quartz and Pyrex substrates was carried out using CF /Ar and CF /O gas m...
Infrared absorption spectroscopy using both a Fourier transform spectrometer and a tunable diode las...
Surface phenomena during atomic layer etching (ALE) of SiO2 were studied during sequential half-cycl...
The plasma of a CF4-quartz etching system is investigated with optical methods. The presence of CF2,...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
SIGLEAvailable from British Library Document Supply Centre- DSC:DX178306 / BLDSC - British Library D...
Infrared absorption spectroscopy has been used to measure the absolute densities of neutral particle...
Low-pressure rf plasmas have been applied for etching of ultra-low-k SiCOH wafers using an Oxford Pl...
Plasma etching, the selective removal of materials by reaction with chemically active species formed...
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO2 etching, with Ar typi...
The effects of gas additives in tetrafluoromethane plasma on the etching characteristics with or wit...
A mass spectrometric analysis of the neutral products and the positive ions extracted from discharge...
International audienceIn this paper, we analyse, by the use of different plasma diagnostics, appeara...
A systematic study of the chemistry of stable molecules and radicals in a low pressure CCl2F2 radio ...
The plasma etching of semiconductor surfaces with fluorine-containing compounds has technological in...
The reactive ion etching of quartz and Pyrex substrates was carried out using CF /Ar and CF /O gas m...
Infrared absorption spectroscopy using both a Fourier transform spectrometer and a tunable diode las...
Surface phenomena during atomic layer etching (ALE) of SiO2 were studied during sequential half-cycl...
The plasma of a CF4-quartz etching system is investigated with optical methods. The presence of CF2,...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
SIGLEAvailable from British Library Document Supply Centre- DSC:DX178306 / BLDSC - British Library D...
Infrared absorption spectroscopy has been used to measure the absolute densities of neutral particle...
Low-pressure rf plasmas have been applied for etching of ultra-low-k SiCOH wafers using an Oxford Pl...
Plasma etching, the selective removal of materials by reaction with chemically active species formed...
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO2 etching, with Ar typi...
The effects of gas additives in tetrafluoromethane plasma on the etching characteristics with or wit...
A mass spectrometric analysis of the neutral products and the positive ions extracted from discharge...
International audienceIn this paper, we analyse, by the use of different plasma diagnostics, appeara...
A systematic study of the chemistry of stable molecules and radicals in a low pressure CCl2F2 radio ...
The plasma etching of semiconductor surfaces with fluorine-containing compounds has technological in...
The reactive ion etching of quartz and Pyrex substrates was carried out using CF /Ar and CF /O gas m...
Infrared absorption spectroscopy using both a Fourier transform spectrometer and a tunable diode las...
Surface phenomena during atomic layer etching (ALE) of SiO2 were studied during sequential half-cycl...