For manufacturers of high-tech multi-disciplinary systems such as semiconductor equipment, the effort required for integration and system testing is ever increasing, while customers demand a shorter time-to-market.This book describes how executable models can replace unavailable component realizations, enabling early integration and system testing. Using a range of model-based techniques, system level problems can be detected earlier, resulting in lower costs, less rework, and a shorter time-to-market. By coupling the models to the available component realizations in a real-time environment, the system level behavior can be tested months before the complete system is realized. An industrial application clearly shows the practical applicabil...
New methods and techniques are needed to reduce the integration and test effort (lead time, costs, r...
This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in ...
To reduce the lead time and the costs of integrating and testing high-tech multi-disciplinary system...
For manufacturers of high-tech multi-disciplinary systems such as semiconductor equipment, the effor...
New methods and techniques are needed to reduce the very costly integration and test effort (in term...
AbstractNew methods and techniques are needed to reduce the very costly integration and test effort ...
To reduce the integration and test effort for high-tech multi-disciplinary systems, we are developin...
The effort required for integration and testing of high-tech multi-disciplinary systems is increasin...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
New methods and techniques are needed to reduce the integration and test effort (lead time, costs, r...
New methods and techniques are needed to reduce the integration and test effort (lead time, costs, r...
This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in ...
To reduce the lead time and the costs of integrating and testing high-tech multi-disciplinary system...
For manufacturers of high-tech multi-disciplinary systems such as semiconductor equipment, the effor...
New methods and techniques are needed to reduce the very costly integration and test effort (in term...
AbstractNew methods and techniques are needed to reduce the very costly integration and test effort ...
To reduce the integration and test effort for high-tech multi-disciplinary systems, we are developin...
The effort required for integration and testing of high-tech multi-disciplinary systems is increasin...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
Industrial trends show that the lead time and costs of integrating and testing high-tech multi-disci...
New methods and techniques are needed to reduce the integration and test effort (lead time, costs, r...
New methods and techniques are needed to reduce the integration and test effort (lead time, costs, r...
This paper describes three Ph.D. projects performed in the framework of the Tangram project [1], in ...
To reduce the lead time and the costs of integrating and testing high-tech multi-disciplinary system...