It is a widespread practice to glue mated soft ferrite core halves in the manufacture of inductive components. However, thermally-induced stresses can initiate fracture of the ferrite core in such an inductive component, e.g., a transformer in a switchmode power supply. Therefore, it is essential for designers to know the magnitude of these stresses compared with the strength of the ferrite material. These thermally-induced stresses can originate from and/or be enhanced by: the conditions for gluing of the mated core halves; thermal cycling tests; and trends to a higher power throughput, leading to a higher working temperature (100-1250 degrees C). The magnitude of thermal stresses has been studied for some relevant cases. Absolute stress l...
Cladded pressure vessels and pipes made from ferritic steels with an austenitic cladding are widely ...
The influence of a ferrite areal fraction within a martensite matrix on fatigue crack propagation is...
Reliability problems in microelectronics package, its interconnection as well as the interfaces, cau...
It is a widespread practice to glue mated soft ferrite core halves in the manufacture of inductive c...
We present experimental measurement of thermal effects on magnetic hysteresis of soft ferrite cores ...
The article presents the results of a study of the effect of mechanical load on the temperature depe...
New demands on the thermo-mechanical design of sintered silver interconnections emerge. Development ...
Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and pas...
The paper reports on thermo-mechanical performance analyses of power semiconductors. Realistic trans...
This paper presents a crystal plasticity model to predict the tensile response and crack initiation ...
This paper presents a series of experiment results on the ageing effects of cyclic junction temperat...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
A thermal stressing technique was applied to evaluate two distinct flaw populations (surface and cor...
The high-temperature stress-rupture properties of a ferritic steel (Crofer 22 H) for use as an inter...
HITEN 2005 - International Conference on High Temperature Electronics, Paris, FRANCE, 06-/09/2005 - ...
Cladded pressure vessels and pipes made from ferritic steels with an austenitic cladding are widely ...
The influence of a ferrite areal fraction within a martensite matrix on fatigue crack propagation is...
Reliability problems in microelectronics package, its interconnection as well as the interfaces, cau...
It is a widespread practice to glue mated soft ferrite core halves in the manufacture of inductive c...
We present experimental measurement of thermal effects on magnetic hysteresis of soft ferrite cores ...
The article presents the results of a study of the effect of mechanical load on the temperature depe...
New demands on the thermo-mechanical design of sintered silver interconnections emerge. Development ...
Power core (PC) sandwiched between two insulated metal substrates (IMS) and embedding active and pas...
The paper reports on thermo-mechanical performance analyses of power semiconductors. Realistic trans...
This paper presents a crystal plasticity model to predict the tensile response and crack initiation ...
This paper presents a series of experiment results on the ageing effects of cyclic junction temperat...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
A thermal stressing technique was applied to evaluate two distinct flaw populations (surface and cor...
The high-temperature stress-rupture properties of a ferritic steel (Crofer 22 H) for use as an inter...
HITEN 2005 - International Conference on High Temperature Electronics, Paris, FRANCE, 06-/09/2005 - ...
Cladded pressure vessels and pipes made from ferritic steels with an austenitic cladding are widely ...
The influence of a ferrite areal fraction within a martensite matrix on fatigue crack propagation is...
Reliability problems in microelectronics package, its interconnection as well as the interfaces, cau...