Influence of grain size on the transport properties of Ni80Fe20 and Cu thin films
- Rijks, T.G.S.M.
- Sour, R.L.H.
- Neerinck, D.G.
- Veirman, de, A.E.M.
- Coehoorn, R.
- Kools, J.C.S.
- Gillies, M.F.
- Jonge, de, W.J.M.
DOIAbstract
The conductivity of sputtered Ta/Cu/Ta and Ta/Ni80Fe20/Ta thin films was measured for a film thickness ranging from 20 to 1500 Angstrom. The measured data were analyzed using a semi-classical model for the electron transport, that includes grain boundary scattering. It was found that in these films grain boundaries are an important source of electron scattering, in Ni80Fe20 leading to an effective spin dependence of the scattering which is considerably smaller than the intrinsic spin dependence of the scattering
Add to ORKG