The operation time of an ideal reliable wafer scanner model is defined at the die level where the actual exposure process takes place as the time unit per die, or at the wafer substrate level as the time unit per wafer substrate. Therefore, the machine throughput is given as the reciprocal of the operation time. The involved motion profiles of a machine, namely the step-and-scan trajectories, function as the heartbeats that drive its multidisciplinary elements, which suggests that a multidisciplinary design optimization should be involved when such profiles are selected or designed. This is also true when considering the traverse motion profiles among rows and columns within the wafer substrate. The step-and-scan trajectories affect the mac...