Thin film III-V devices integrated on silicon-on-insulator waveguide circuits

Thin film InP/InGaAsP active opto-electronic devices were fabricated on top of Silicon-on-Insulator waveguide circuits. Device integration was done using adhesive die to wafer bonding. Both photodetectors and laser diodes were fabricated on and coupled to Silicon-on-Insulator waveguide circuits. Integration of laser diodes and photodetectors was done simultaneously using identical processing steps. copyright The Electrochemical Society.