In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained
Northrop Grumman Aerospace Systems (NGAS) has developed a Wafer Scale Assembly (WSA) process that is...
Intimate integration of photonics with electronics is regarded as the key to further improvement in ...
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described...
Abstract: The bonding of InP/InGaAsP heterostructures dies onto an SOI substrate is reported. Bondin...
Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are...
Wafer scale co-integration of the EICs to the PICs using the adhesion bonding technique can open up ...
We present the heterogeneous integration of InP/InGaAsP photodetectors onto ultracompact Silicon-on-...
Intimate integration of photonics with electronics is regarded as the key to further improvement in ...
Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform ...
Applications such as radar imaging and wideband communications are driving the research on millimete...
the niti e b tion for decreasing the total global interconnect length that can lim-it IC performance...
Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications b...
GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integr...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
Northrop Grumman Aerospace Systems (NGAS) has developed a Wafer Scale Assembly (WSA) process that is...
Intimate integration of photonics with electronics is regarded as the key to further improvement in ...
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...
In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described...
Abstract: The bonding of InP/InGaAsP heterostructures dies onto an SOI substrate is reported. Bondin...
Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are...
Wafer scale co-integration of the EICs to the PICs using the adhesion bonding technique can open up ...
We present the heterogeneous integration of InP/InGaAsP photodetectors onto ultracompact Silicon-on-...
Intimate integration of photonics with electronics is regarded as the key to further improvement in ...
Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform ...
Applications such as radar imaging and wideband communications are driving the research on millimete...
the niti e b tion for decreasing the total global interconnect length that can lim-it IC performance...
Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications b...
GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integr...
The integration of optical functionalities on a chip has been a long standing goal in the optical co...
Northrop Grumman Aerospace Systems (NGAS) has developed a Wafer Scale Assembly (WSA) process that is...
Intimate integration of photonics with electronics is regarded as the key to further improvement in ...
The continuation of Moore’s law by conventional complementary metal oxide semiconductor (CMOS) scali...