This report presents the results of the work of one year in Sapiens Steering Brain Stimulation. A general description of the company objective is given and later the project is defined. The project has two main sub-projects: the characterization of the materials to be used as encapsulation for electronics and the mechanical testing of the isolative layers of the thin film, as an essential part of the implantable part of the device. For the first sub-project, the coating parameters are investigated through time experiments of samples exposed in saline. For the second part, samples are put under bending stress and mechanical tolerance is tested. Any mechanical failure or defective coating will have as a consequence an amount of current to lea...
Thin organic coatings commonly are used for insulating microelectrodes and electronic packages desig...
Three test methods are shown that allow running accelerated in vitro tests to investigate biostabili...
Electronic components in the form of application-specific integrated circuits (ASICs) establishing t...
This report presents the results of the work of one year in Sapiens Steering Brain Stimulation. A ge...
Investigation methods on polymer encapsulation materials were implemented to determine the quality o...
Abstract—The thrust of this project was to evaluate commercial conformal encapsulation candidates fo...
Neural interfaces, devices that interact with nervous system, have been studied to help patients wit...
Implantable and direct contact electronic devices for underpinning complex tissue functions as well ...
The selection of the optimum material for an encapsulation application can be a challenging task, as...
Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine lo...
The encapsulation of electronic systems to be implanted in the human body has to ensure a hermetic s...
There is a strong demand of implantable devices for diverse applications. Most of them are dedicated...
Electronic components in the form of application-specific integrated circuits (ASICs) establishing t...
Current state-of-the-art implantable micron feature electronic devices are capable of monitoring and...
Implants are commonly used for orthopaedic and dental applications. There is however a problem with ...
Thin organic coatings commonly are used for insulating microelectrodes and electronic packages desig...
Three test methods are shown that allow running accelerated in vitro tests to investigate biostabili...
Electronic components in the form of application-specific integrated circuits (ASICs) establishing t...
This report presents the results of the work of one year in Sapiens Steering Brain Stimulation. A ge...
Investigation methods on polymer encapsulation materials were implemented to determine the quality o...
Abstract—The thrust of this project was to evaluate commercial conformal encapsulation candidates fo...
Neural interfaces, devices that interact with nervous system, have been studied to help patients wit...
Implantable and direct contact electronic devices for underpinning complex tissue functions as well ...
The selection of the optimum material for an encapsulation application can be a challenging task, as...
Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine lo...
The encapsulation of electronic systems to be implanted in the human body has to ensure a hermetic s...
There is a strong demand of implantable devices for diverse applications. Most of them are dedicated...
Electronic components in the form of application-specific integrated circuits (ASICs) establishing t...
Current state-of-the-art implantable micron feature electronic devices are capable of monitoring and...
Implants are commonly used for orthopaedic and dental applications. There is however a problem with ...
Thin organic coatings commonly are used for insulating microelectrodes and electronic packages desig...
Three test methods are shown that allow running accelerated in vitro tests to investigate biostabili...
Electronic components in the form of application-specific integrated circuits (ASICs) establishing t...